Details

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BUY CD4050BM https://www.utsource.net/itm/p/107002.html
CD4049UBM - Hex Inverting/non-inverting Buffer Life-time Buy , Package: Cerdip, Pin Nb=16

Parameter	Symbol	Conditions	Min	Typ	Max	Unit
Supply Voltage	VCC	-	3	-	15	V
Input Voltage (High)	VIH	-	2	-	VCC	V
Input Voltage (Low)	VIL	-	0	-	0.8	V
Output Voltage (High)	VOH	IO = -1mA	2.4	-	VCC - 0.6	V
Output Voltage (Low)	VOL	IO = 1mA	0	-	0.4	V
Input Current (High)	IIH	VI = VCC	-1	-	10	渭A
Input Current (Low)	IIL	VI = 0V	-1	-	10	渭A
Output Current (Source)	IOH	VO = VCC - 1.5V	-1	-	10	mA
Output Current (Sink)	IOL	VO = 0.4V	1	-	10	mA
Propagation Delay Time	tpd	VCC = 5V, VI = 0V to VCC, VO = 0.5VCC	-	9	35	ns
Power Dissipation	PD	Per Package	-	-	700	mW
Operating Temperature	TA	-	-40	-	85	掳C
Storage Temperature	TSTG	-	-65	-	150	掳C

Instructions for Use:

1. Power Supply:

   • Ensure the supply voltage (V_CC) is within the range of 3V to 15V.
   • Connect the ground (GND) pin to a stable reference ground.

2. Input Signals:

   • Input voltages should be within the specified range (0V to V_CC).
   • Avoid applying voltages outside this range to prevent damage to the device.

3. Output Signals:

   • The output voltage levels will depend on the load and supply voltage.
   • Ensure the load does not exceed the maximum output current ratings.

4. Propagation Delay:

   • The propagation delay time (t_pd) is crucial for timing considerations in digital circuits.
   • Use the typical value for general design purposes, but consider the maximum value for worst-case scenarios.

5. Temperature Considerations:

   • Operate the device within the specified temperature range (-40掳C to 85掳C) to ensure reliable performance.
   • Store the device within the storage temperature range (-65掳C to 150掳C).

6. Handling:

   • Handle the device with care to avoid static discharge, which can damage sensitive components.
   • Follow proper ESD (Electrostatic Discharge) handling procedures.

7. Mounting:

   • Ensure proper mounting and soldering techniques to avoid mechanical stress and thermal issues.
   • Use appropriate heat sinks if necessary, especially for high-power applications.

8. Testing:

   • Test the device under controlled conditions to verify its performance and functionality.
   • Refer to the datasheet for specific test procedures and recommended test setups.

(For reference only)