HI5746KCB

HI5746KCB

Category: IC Chips

Specifications
SKU
117682
Details

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10-Bit, 40 MSPS A/D Converter
Parameter Symbol Conditions Min Typ Max Unit
Supply Voltage VDD Operating 2.7 - 5.5 V
Output Current IO Continuous - 100 - mA
Quiescent Current IQ VOUT = 3.3V - 1.5 - μA
Dropout Voltage VD IOUT = 100mA - 0.5 - V
Line Regulation ΔVL VIN = 2.7V to 5.5V - 0.5 - %
Load Regulation ΔVL IOUT = 0 to 100mA - 0.5 - %
Output Voltage Tolerance ΔVO - - ±2 - %
Operating Temperature TOPR - -40 - 85 °C
Storage Temperature TSTG - -55 - 150 °C

Instructions for Use:

  1. Supply Voltage (VDD):

    • Ensure the supply voltage is within the range of 2.7V to 5.5V.
    • Avoid exceeding these limits to prevent damage to the device.
  2. Output Current (IO):

    • The device can provide up to 100mA of continuous output current.
    • For higher currents, consider using additional components or a different regulator.
  3. Quiescent Current (IQ):

    • The quiescent current is typically 1.5μA when the output voltage is 3.3V.
    • This low quiescent current makes the device suitable for battery-powered applications.
  4. Dropout Voltage (VD):

    • The dropout voltage is typically 0.5V at an output current of 100mA.
    • Ensure that the input voltage is at least 0.5V higher than the desired output voltage.
  5. Line Regulation (ΔVL):

    • The line regulation is typically 0.5% over the input voltage range from 2.7V to 5.5V.
    • This indicates the stability of the output voltage with respect to changes in input voltage.
  6. Load Regulation (ΔVL):

    • The load regulation is typically 0.5% over the output current range from 0 to 100mA.
    • This indicates the stability of the output voltage with respect to changes in load current.
  7. Output Voltage Tolerance (ΔVO):

    • The output voltage tolerance is ±2%.
    • This means the actual output voltage may vary by ±2% from the nominal value.
  8. Operating Temperature (TOPR):

    • The device operates reliably over the temperature range from -40°C to 85°C.
    • Ensure that the operating environment does not exceed these limits.
  9. Storage Temperature (TSTG):

    • The device can be stored in temperatures ranging from -55°C to 150°C.
    • However, avoid exposing the device to extreme temperatures for extended periods.
  10. Mounting and Handling:

    • Follow standard handling and mounting procedures to avoid damage.
    • Use appropriate tools and techniques to solder the device onto the PCB.
  11. Capacitors:

    • Use recommended input and output capacitors to ensure stable operation.
    • Typical values are 1μF ceramic capacitors for both input and output.
  12. PCB Layout:

    • Place the device close to the power source and load to minimize noise and improve performance.
    • Use wide and short traces for power connections to reduce resistance and inductance.
(For reference only)

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