MC68306FC16B

MC68306FC16B


Specifications
SKU
135405
Details

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INTEGRATED EC000 MPU
Parameter Description Min Typ Max Unit
VCC Supply Voltage 4.75 5.0 5.25 V
ICC Supply Current (Typical) - 200 - mA
fosc Oscillator Frequency 1 20 33 MHz
Tamb Operating Temperature Range -40 - 85 °C
Tj Junction Temperature -40 - 125 °C
tpd Propagation Delay - 10 - ns
tsu Setup Time - 5 - ns
thold Hold Time - 2 - ns
VIH Input High Voltage 2.0 - 5.25 V
VIL Input Low Voltage 0.0 - 0.8 V
VOH Output High Voltage 2.4 - 5.0 V
VOL Output Low Voltage 0.0 - 0.4 V
IIH Input High Current - 0.4 - mA
IIL Input Low Current - -0.4 - mA
IOH Output High Current - 4.0 - mA
IOL Output Low Current - -4.0 - mA

Instructions for Use:

  1. Power Supply:

    • Ensure the supply voltage (VCC) is within the range of 4.75V to 5.25V.
    • The typical supply current (ICC) is 200mA.
  2. Oscillator:

    • The oscillator frequency (fosc) can range from 1MHz to 33MHz. Choose an appropriate crystal or oscillator based on your application requirements.
  3. Temperature:

    • The operating ambient temperature (Tamb) should be between -40°C and 85°C.
    • The junction temperature (Tj) should not exceed 125°C.
  4. Timing Parameters:

    • Propagation delay (tpd) is typically 10ns.
    • Setup time (tsu) is typically 5ns.
    • Hold time (thold) is typically 2ns.
  5. Input and Output Levels:

    • Input high voltage (VIH) should be between 2.0V and 5.25V.
    • Input low voltage (VIL) should be between 0.0V and 0.8V.
    • Output high voltage (VOH) should be between 2.4V and 5.0V.
    • Output low voltage (VOL) should be between 0.0V and 0.4V.
  6. Current Specifications:

    • Input high current (IIH) is typically 0.4mA.
    • Input low current (IIL) is typically -0.4mA.
    • Output high current (IOH) is typically 4.0mA.
    • Output low current (IOL) is typically -4.0mA.
  7. Handling:

    • Handle the device with care to avoid static discharge, which can damage the internal circuits.
    • Follow proper soldering techniques to ensure reliable connections.
  8. Storage:

    • Store the device in a dry, cool place to prevent moisture damage.
  9. Testing:

    • Before integrating the device into a circuit, test it using a known good setup to ensure it meets the specified parameters.
(For reference only)

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