Details

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BUY ICM7242IPA https://www.utsource.net/itm/p/156165.html
Fixed And Programmable Timer/Counters

Parameter	Symbol	Min	Typical	Max	Unit	Conditions
Supply Voltage	Vcc	3.0	5.0	7.0	V
Operating Temperature	Toper	-40		85	°C
Storage Temperature	Tstg	-65		150	°C
Input Voltage Range	Vin	0		Vcc+0.3	V
Output Voltage (High)	VOH	Vcc-0.4	Vcc-0.1	Vcc-0.1	V	IOL = 0.4 mA
Output Voltage (Low)	VOL	0	0.1	0.4	V	IOH = -0.4 mA
Input Leakage Current	IIK	-1	0	1	μA	Vin = 0 to Vcc
Output Leakage Current	IOLK	-1	0	1	μA	VO = 0 to Vcc
Propagation Delay Time	tpd	10	15	25	ns	Vcc = 5V, TA = 25°C
Power Dissipation	PD			250	mW	Per Package

Instructions for Use:

1. Power Supply:

   • Ensure the supply voltage is within the specified range of 3.0V to 7.0V.
   • Use appropriate decoupling capacitors (typically 0.1μF and 10μF) close to the power pins to stabilize the supply.

2. Input Signals:

   • Input voltages should not exceed Vcc + 0.3V or go below 0V to avoid damaging the device.
   • Ensure input signals are clean and within the specified range to prevent incorrect operation.

3. Output Signals:

   • The output high level (VOH) should be at least Vcc - 0.1V when sourcing 0.4 mA.
   • The output low level (VOL) should be no more than 0.4V when sinking 0.4 mA.
   • Use appropriate pull-up or pull-down resistors if necessary to ensure proper logic levels.

4. Temperature Considerations:

   • Operate the device within the temperature range of -40°C to 85°C for reliable performance.
   • Store the device within the storage temperature range of -65°C to 150°C.

5. Propagation Delay:

   • The propagation delay time (tpd) is typically 15 ns at Vcc = 5V and TA = 25°C. Ensure your timing requirements are compatible with this delay.

6. Power Dissipation:

   • The maximum power dissipation per package is 250 mW. Ensure adequate heat dissipation if operating near this limit.

7. Handling:

   • Handle the device with care to avoid static damage. Use proper ESD protection measures.
   • Follow recommended soldering profiles to avoid thermal stress during assembly.

8. Testing:

   • Perform initial testing under controlled conditions to verify correct operation.
   • Use a breadboard or prototyping board for initial tests before final integration into a circuit.

By following these guidelines, you can ensure optimal performance and reliability of the ICM7242IPA in your application.

(For reference only)