DM74LS138N

DM74LS138N


Specifications
SKU
183382
Details

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Decoder/Demultiplexer
Parameter Symbol Conditions Min Typ Max Unit
Supply Voltage VCC Operating 4.75 5.0 5.25 V
Input Voltage (High) VIH IIH = 20 μA 2.0 - 5.5 V
Input Voltage (Low) VIL IIL = -0.4 mA 0.0 - 0.8 V
Output Voltage (High) VOH IOH = -0.4 mA 2.4 - 5.0 V
Output Voltage (Low) VOL IOL = 16 mA 0.0 - 0.5 V
Propagation Delay Time tpd VCC = 5V, TA = 25°C - 22 - ns
Power Dissipation PD Maximum - - 100 mW

Instructions for Using DM74LS138N

  1. Pin Configuration:

    • 1, 2, 3: Address inputs A, B, C
    • 4, 5, 6, 7, 9, 10, 11, 12: Active low outputs Y0 to Y7
    • 8: Ground (GND)
    • 13: Output enable (G1)
    • 14, 15: Chip select inputs (G2A, G2B)
    • 16: Power supply (VCC)
  2. Operation:

    • The DM74LS138N is a 3-to-8 line decoder/demultiplexer.
    • It has three address inputs (A, B, C) that select one of eight outputs (Y0 to Y7).
    • The chip select inputs (G2A, G2B) and the output enable input (G1) must be active low for the decoder to function.
    • When all chip select and enable inputs are low, the selected output corresponding to the address inputs will be low, and all other outputs will be high.
  3. Power Supply:

    • Connect VCC to +5V and GND to 0V.
    • Ensure the power supply voltage remains within the specified range to avoid damage to the device.
  4. Addressing Outputs:

    • The address inputs A, B, and C determine which output is activated.
    • For example, if A = 0, B = 1, and C = 1, then Y3 will be low, and all other outputs will be high.
  5. Chip Select and Enable:

    • G1, G2A, and G2B must all be low for the decoder to be active.
    • If any of these inputs are high, all outputs will be high, regardless of the address inputs.
  6. Propagation Delay:

    • The propagation delay time (tpd) is the time it takes for a change in the input to affect the output. It is typically 22 ns at 5V and 25°C.
  7. Power Dissipation:

    • The maximum power dissipation is 100 mW. Ensure proper heat management if operating near this limit.
  8. Handling:

    • Handle the device with care to avoid static discharge, which can damage the internal circuits.
    • Use appropriate ESD protection when handling and soldering the device.
(For reference only)

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