Details
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CMOS DUAL 2-INPUT NAND BUFFER/DRIVER
Parameter | Description | Min | Typ | Max | Unit |
---|---|---|---|---|---|
Supply Voltage (VCC) | Operating supply voltage range | 3 | - | 15 | V |
Input Voltage (VIH) | High-level input voltage | - | 70% VCC | - | V |
Input Voltage (VIL) | Low-level input voltage | - | 30% VCC | - | V |
Output Voltage (VOH) | High-level output voltage | - | 90% VCC | - | V |
Output Voltage (VOL) | Low-level output voltage | - | 10% VCC | - | V |
Input Current (IIN) | Input current per pin | - | 1 | 20 | 渭A |
Output Current (IOH) | High-level output current | - | - | 4 | mA |
Output Current (IOL) | Low-level output current | - | - | 8 | mA |
Propagation Delay Time (tpd) | Propagation delay time | 6 | - | 20 | ns |
Power Dissipation (PD) | Maximum power dissipation | - | - | 100 | mW |
Operating Temperature Range (TA) | Ambient operating temperature range | -40 | - | 85 | 掳C |
Storage Temperature Range (TSTG) | Storage temperature range | -65 | - | 150 | 掳C |
Instructions for Use
Power Supply:
- Ensure the supply voltage (VCC) is within the specified range of 3V to 15V.
- Connect the ground (GND) pin to a stable ground reference.
Input Signals:
- High-level input signals should be at least 70% of VCC.
- Low-level input signals should be no more than 30% of VCC.
- Input currents should not exceed 20 渭A to avoid damage.
Output Signals:
- High-level output signals will be at least 90% of VCC.
- Low-level output signals will be no more than 10% of VCC.
- Ensure that the output current does not exceed 4 mA for high-level outputs and 8 mA for low-level outputs.
Propagation Delay:
- The propagation delay time (tpd) can vary from 6 ns to 20 ns, depending on the specific device and operating conditions.
Thermal Management:
- The maximum power dissipation is 100 mW. Ensure proper heat sinking or cooling if operating near this limit.
- The ambient operating temperature range is from -40掳C to 85掳C. Store the device between -65掳C and 150掳C.
Handling:
- Handle the device with care to avoid static discharge, which can damage the internal circuits.
- Follow standard ESD (Electrostatic Discharge) precautions when handling and installing the device.
Mounting:
- Solder the device using a temperature-controlled soldering iron to avoid thermal shock.
- Ensure all connections are secure and free from shorts or open circuits.
Testing:
- Test the device under typical operating conditions to verify its functionality.
- Use a multimeter or oscilloscope to check input and output voltages and currents.
By following these guidelines, you can ensure reliable operation of the CD40107 device in your circuit.
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