Details

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BUY MG100Q2YS50 https://www.utsource.net/itm/p/199838.html
TRANS IGBT MODULE N-CH 1200V 150A 7(2-95A4A)

Parameter	Description	Value
Part Number	Full part number	MG100Q2YS50
Type	Type of component	MOSFET
Package	Package type	TO-220
VDS (Max)	Drain-to-Source Voltage	100 V
VGS (Max)	Gate-to-Source Voltage	±20 V
ID (Max)	Continuous Drain Current (at 25°C)	50 A
RDS(on) (Max)	On-State Resistance (at VGS = 10 V)	2.5 mΩ
Power Dissipation	Maximum Power Dissipation (at 25°C)	150 W
Operating Temp.	Operating Temperature Range	-55°C to 150°C
Storage Temp.	Storage Temperature Range	-65°C to 150°C
Junction Temp.	Maximum Junction Temperature	175°C
Thermal Resistance	Junction-to-Case Thermal Resistance	0.85 °C/W
Gate Charge	Total Gate Charge	140 nC
Input Capacitance	Input Capacitance (at VDS = 10 V)	1450 pF
Output Capacitance	Output Capacitance (at VDS = 10 V)	100 pF
Reverse Transfer Capacitance	Reverse Transfer Capacitance (at VDS = 10 V)	35 pF

Instructions for Use:

1. Handling and Storage:

   • Store in a dry, cool place away from direct sunlight.
   • Handle with care to avoid damage to the leads and package.

2. Mounting:

   • Ensure proper heat sinking to manage thermal dissipation.
   • Use a suitable heatsink compound to enhance thermal conductivity between the device and heatsink.

3. Electrical Connections:

   • Connect the drain, source, and gate terminals correctly to avoid damage.
   • Use appropriate wire gauges to handle the current ratings.

4. Operational Precautions:

   • Do not exceed the maximum ratings for VDS, VGS, and ID.
   • Ensure the junction temperature does not exceed 175°C.
   • Avoid rapid temperature changes that can cause thermal stress.

5. Testing:

   • Use a compatible test setup to verify the functionality of the MOSFET.
   • Follow standard testing procedures to ensure accurate results.

6. Safety:

   • Always follow safety guidelines when working with high voltages and currents.
   • Use protective equipment such as gloves and goggles when handling the component.

7. Disposal:

   • Dispose of the component according to local regulations for electronic waste.

(For reference only)