Details

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BUY 74ACT574SCX https://www.utsource.net/itm/p/251244.html
Octal D-Type Flip-Flop

Parameter	Symbol	Min	Typ	Max	Unit	Conditions
Supply Voltage	VCC	2.0	-	3.6	V
Output High Voltage	VOH	-	2.4	3.6	V	IOL = -4 mA, VCC = 3.6 V
Output Low Voltage	VOL	0	0.4	0.8	V	IOH = 4 mA, VCC = 3.6 V
Input High Voltage	VIH	2.0	-	3.6	V
Input Low Voltage	VIL	0	0.8	1.0	V
Propagation Delay Time	tpd	-	3.5	6.0	ns	VCC = 3.6 V, TA = 25°C
Setup Time	tsu	2	-	6	ns	VCC = 3.6 V, TA = 25°C
Hold Time	th	0	-	4	ns	VCC = 3.6 V, TA = 25°C
Clock Pulse Width (High)	tCH	10	-	-	ns	VCC = 3.6 V, TA = 25°C
Clock Pulse Width (Low)	tCL	10	-	-	ns	VCC = 3.6 V, TA = 25°C
Operating Temperature Range	TA	-40	-	85	°C
Storage Temperature Range	TSTG	-65	-	150	°C

Instructions for Use:

1. Power Supply:

   • Ensure the supply voltage (V_CC) is within the specified range of 2.0 V to 3.6 V.
   • Connect the ground (GND) pin to a stable 0 V reference.

2. Input Signals:

   • Apply input signals (D0-D7) that meet the input high (VIH) and input low (VIL) voltage levels.
   • Ensure the setup time (t_su) and hold time (t_h) requirements are met for reliable data capture.

3. Clock Signal:

   • The clock signal (CLK) should have a high pulse width (t_CH) and low pulse width (t_CL) within the specified ranges.
   • Ensure the propagation delay (t_pd) is considered for timing calculations.

4. Output Signals:

   • The output signals (Q0-Q7) will follow the input signals after the clock edge, with the specified propagation delay.
   • Ensure the output high (VOH) and output low (VOL) voltage levels are within the specified limits for the connected load.

5. Temperature Considerations:

   • Operate the device within the specified operating temperature range (T_A) to ensure reliable performance.
   • Store the device within the storage temperature range (T_STG) to prevent damage.

6. Handling:

   • Handle the device with care to avoid static discharge, which can damage the internal circuits.
   • Follow proper soldering techniques to ensure good electrical connections and avoid thermal stress.

7. Testing:

   • Perform functional tests at room temperature to verify correct operation.
   • For critical applications, consider environmental testing to ensure robust performance across all operating conditions.

(For reference only)