Details

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BUY MAX942EPA https://www.utsource.net/itm/p/309407.html
High-Speed, Low-Power, 3V/5V, Rail-to-Rail Single-Supply Comparators

Parameter	Symbol	Min	Typ	Max	Unit	Conditions
Supply Voltage	VCC	4.5	-	5.5	V
Input Common-Mode Voltage	VCM	0.3	-	3.0	V
Differential Input Voltage	VID	-1.0	-	1.0	V
Output Voltage (High)	VOH	2.4	2.7	3.0	V	VCC = 5V, IOH = -4mA
Output Voltage (Low)	VOL	0.0	0.4	0.8	V	VCC = 5V, IOL = 16mA
Input Bias Current	IB	-10	0	10	nA
Slew Rate	SR	1000	1500	2000	V/μs
Propagation Delay	tpd	2	4	6	ns	VCC = 5V, VCM = 1.5V, VID = 200mV
Power Dissipation	PD	-	125	-	mW	VCC = 5V, TA = 25°C
Operating Temperature Range	TOPR	-40	-	85	°C
Storage Temperature Range	TSTG	-65	-	150	°C

Instructions for Use:

1. Power Supply:

   • Ensure the supply voltage (VCC) is within the range of 4.5V to 5.5V.
   • Connect a decoupling capacitor (typically 0.1 μF) close to the power pins to reduce noise.

2. Input Signals:

   • The input common-mode voltage (VCM) should be between 0.3V and 3.0V.
   • The differential input voltage (VID) should not exceed ±1.0V.

3. Output Configuration:

   • The output voltage high (VOH) should be at least 2.4V when the output current (IOH) is -4mA.
   • The output voltage low (VOL) should be no more than 0.8V when the output current (IOL) is 16mA.

4. Bias Current:

   • The input bias current (IB) is typically around 0nA, with a maximum deviation of ±10nA.

5. Performance Considerations:

   • The slew rate (SR) is typically 1500 V/μs, which helps in fast signal transitions.
   • The propagation delay (tpd) is typically 4 ns, ensuring quick response times.

6. Thermal Management:

   • The power dissipation (PD) is typically 125 mW at 5V supply and 25°C ambient temperature.
   • The operating temperature range (TOPR) is from -40°C to 85°C.
   • The storage temperature range (TSTG) is from -65°C to 150°C.

7. Handling and Storage:

   • Store the device in a dry, cool place within the specified storage temperature range.
   • Handle the device with care to avoid electrostatic discharge (ESD) damage. Use ESD protection equipment when handling the device.

8. Mounting and Assembly:

   • Follow standard surface mount technology (SMT) procedures for mounting the device on a PCB.
   • Ensure proper soldering to all pins to avoid cold solder joints and ensure reliable operation.

9. Testing:

   • Before final assembly, test the device under typical operating conditions to ensure it meets the specified parameters.

10. Application Notes:

    • Refer to the datasheet and application notes provided by Maxim Integrated for detailed information on specific applications and configurations.

(For reference only)