MG150Q2YS9

MG150Q2YS9

Category: ModulesIGBT

Specifications
Details

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N CHANNEL IGBT (HIGH PWER SWITCHING, MOTOR CONTROL APPLICATIONS)
Parameter Description
Part Number MG150Q2YS9
Type MOSFET (Metal-Oxide-Semiconductor Field-Effect Transistor)
Configuration N-Channel
VDS (Drain-Source Voltage) 150 V
RDS(on) (On-Resistance) 2.4 mΩ (Typical @ VGS=10V, IDS=36A)
ID (Continuous Drain Current) 36 A (at Ta=25°C)
PD (Total Power Dissipation) 270 W (at Tc=25°C)
VGS(th) (Gate-Source Threshold Voltage) 2.0 to 4.0 V
Package Type TO-247
Operating Temperature Range -55°C to 175°C
Mounting Type Through Hole
Lead Finish Matte Tin

Instructions for Use:

  1. Handling Precautions: The MG150Q2YS9 is sensitive to electrostatic discharge (ESD). Use proper ESD protection measures during handling and installation.
  2. Heat Sinking: Ensure adequate heat sinking for applications where the device will operate near its maximum power dissipation limits.
  3. Mounting: When mounting the device, ensure that the mounting torque does not exceed the specified limit for the TO-247 package to avoid damage.
  4. Voltage and Current Limits: Do not exceed the maximum ratings for VDS, ID, or PD as listed in the parameter table. Operating beyond these limits can lead to permanent damage.
  5. Gate Drive Requirements: Ensure that the gate drive circuitry provides sufficient voltage levels to fully turn on the MOSFET and minimize RDS(on).
  6. Thermal Management: Monitor the operating temperature and ensure it remains within the specified range to prevent thermal runaway.
  7. Storage Conditions: Store in a dry, cool environment away from direct sunlight and corrosive materials.
(For reference only)

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