Details

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BUY MAX197AEAI https://www.utsource.net/itm/p/337527.html
Multi-Range 【10V, 【5V, +10V, +5V, Single +5V, 12-Bit DAS with 8+4 Bus Interface

Parameter	Symbol	Conditions	Min	Typ	Max	Unit
Supply Voltage	VCC	Operating	4.5	5.0	5.5	V
Reference Voltage	VREF	Internal	2.048	-	2.048	V
Input Voltage Range	VIN	Relative to GND	0	-	VCC - 2.0	V
Conversion Time	tCNV	12-bit, typical	-	10	-	μs
Power Consumption	ICC	Active mode	10	15	20	mA
Power Consumption	ICC	Shutdown mode	-	1	2	μA
Output Data Rate	fODR	Maximum	-	100	-	kSPS
Differential Nonlinearity	DNL	±LSB	-1	0	+1	LSB
Integral Nonlinearity	INL	±LSB	-2	0	+2	LSB
Signal-to-Noise Ratio	SNR	Typical, 12-bit	-	73	-	dB
Temperature Range	TOP	Commercial	0	-	70	°C
Temperature Range	TOP	Extended	-40	-	85	°C

Instructions for Using MAX197AEAI

1. Power Supply:

   • Connect the V_CC pin to a stable 5V supply.
   • Ensure the ground (GND) is properly connected.

2. Reference Voltage:

   • The internal reference voltage is 2.048V. If an external reference is used, it should be within the specified range.

3. Input Signals:

   • Apply input signals to the analog input pins (AIN0 to AIN7).
   • Ensure the input voltage is within the range of 0V to V_CC - 2.0V.

4. Conversion Control:

   • Use the CS (Chip Select), RD (Read), WR (Write), and SGL/DIFF (Single/Differential) pins to control the conversion process.
   • Set the SGL/DIFF pin to select single-ended or differential input mode.
   • Use the ADDR0 and ADDR1 pins to select the input channel.

5. Data Output:

   • Read the conversion results from the data output pins (D0 to D7).
   • Ensure the data bus is stable before reading the data.

6. Shutdown Mode:

   • To enter shutdown mode, set the SHDN pin high.
   • In shutdown mode, power consumption is significantly reduced.

7. Temperature Considerations:

   • Operate the device within the specified temperature range to ensure reliable performance.
   • For extended temperature ranges, refer to the extended temperature range specifications.

8. Handling Precautions:

   • Handle the device with care to avoid electrostatic discharge (ESD) damage.
   • Follow proper soldering and handling procedures during assembly.

(For reference only)