Details

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BUY TPS3619-33DGK https://www.utsource.net/itm/p/372706.html
BACKUP-BATTERY SUPERVISORS FOR RAM RETENTION

Parameter	Symbol	Min	Typical	Max	Unit	Notes
Supply Voltage	VDD	1.7		5.5	V
Threshold Voltage	VTH	2.9	3.0	3.1	V
Hysteresis Voltage	VHYS	140	180	220	mV
Output Leakage Current	IOL	-1		-5	μA	@ VOUT = 0V, VDD = 5.5V
Output High-State Voltage	VOH	0.85		VDD	V	@ IOUT = 1μA, VDD = 5.5V
Output Low-State Voltage	VOL	0		0.4	V	@ IOUT = 100μA, VDD = 5.5V
Quiescent Current	IQ	0.6		1.2	μA	@ VDD = 3.0V, TJ = 25°C
Operating Temperature	TJ	-40		125	°C
Storage Temperature	TSTG	-65		150	°C

Instructions for Using TPS3619-33DGK

1. Supply Voltage (VDD):

   • The device operates with a supply voltage ranging from 1.7V to 5.5V. Ensure that the supply voltage is within this range to avoid damage or improper operation.

2. Threshold Voltage (VTH):

   • The threshold voltage is set at 3.0V with a tolerance of ±0.1V. The device will switch its output based on whether the input voltage is above or below this threshold.

3. Hysteresis Voltage (VHYS):

   • The hysteresis voltage is typically 180mV, which helps prevent oscillation around the threshold voltage. This ensures stable operation even in noisy environments.

4. Output States:

   • When the input voltage is below the threshold (VTH - VHYS), the output is high (VOH).
   • When the input voltage is above the threshold (VTH + VHYS), the output is low (VOL).

5. Quiescent Current (IQ):

   • The quiescent current is very low, typically 0.6μA at room temperature. This makes the device suitable for battery-powered applications.

6. Temperature Range:

   • The device can operate over a wide temperature range from -40°C to 125°C, making it suitable for various environmental conditions.

7. Storage Temperature (TSTG):

   • Store the device in a temperature range from -65°C to 150°C to ensure long-term reliability.

8. Handling Precautions:

   • Handle the device with care to avoid electrostatic discharge (ESD) damage. Use proper ESD protection equipment when handling the device.

9. Mounting and Soldering:

   • Follow recommended soldering profiles to avoid thermal stress that could damage the device. Ensure proper alignment and soldering of the pins to the PCB.

10. Testing:

    • Test the device in a controlled environment to verify its performance parameters before integrating it into your application.

(For reference only)