Details

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BUY EP20K200EFC484-1 https://www.utsource.net/itm/p/377010.html
IC APEX 20KE FPGA 200K 484-FBGA

Parameter	Description	Value
Device Type	FPGA (Field-Programmable Gate Array)	EP20K200EFC484-1
Family	Cyclone II	-
Package	Fine Line BGA (FBGA)	FC484
Speed Grade	Commercial	-1
I/O Banks	Number of I/O Banks	16
I/O Pins	Total I/O Pins	432
Core Voltage	VCCINT (Core Supply Voltage)	1.5V ± 5%
I/O Voltage	VCCIO (I/O Supply Voltage)	1.2V, 1.5V, 1.8V, 2.5V, 3.3V
Configuration Memory	User Flash Memory (UFM)	512 Kbits
Configuration Modes	Active Serial (AS), Passive Serial (PS), JTAG, AS with UFM, PS with UFM	-
Configuration Interface	JTAG, AS, PS, USB-Blaster	-
Operating Temperature Range	Commercial	0°C to +85°C
Industrial	-40°C to +85°C
Storage Temperature Range	-65°C to +150°C	-
Static Power Consumption	Typical @ 25°C	100 mW
Dynamic Power Consumption	Typical @ 100 MHz, 50% utilization	1.2 W
Clock Resources	Global Clocks	8
Regional Clocks	16
PLLs (Phase-Locked Loops)	2
Logic Elements (LEs)	Total LEs	200,000
Dedicated Multipliers	9-bit x 9-bit	128
Embedded Memory	M4K Blocks	288 Kbits
Maximum User I/Os	432
Maximum User I/Os per Bank	27
Maximum User I/Os per Pin	1
Maximum Frequency	Internal Clock	300 MHz
External Clock	300 MHz
Power-Up Time	Typical	10 ms
Configuration Time	Typical	10 ms (AS), 20 ms (PS)

Instructions for Use:

1. Power Supply:

   • Ensure that the core voltage (VCCINT) is set to 1.5V ± 5%.
   • Set the I/O voltage (VCCIO) according to the specific I/O standard being used (1.2V, 1.5V, 1.8V, 2.5V, or 3.3V).

2. Configuration:

   • Use one of the supported configuration modes: Active Serial (AS), Passive Serial (PS), JTAG, AS with UFM, or PS with UFM.
   • For AS and PS modes, ensure the appropriate configuration interface (JTAG, AS, PS, or USB-Blaster) is connected.

3. Clocking:

   • Utilize the 8 global clocks and 16 regional clocks for clock distribution.
   • Use the 2 PLLs for clock synthesis and phase alignment.

4. Memory:

   • Use the 288 Kbits of embedded memory (M4K blocks) for data storage and processing.

5. Temperature:

   • Operate the device within the specified temperature range (0°C to +85°C for commercial grade, -40°C to +85°C for industrial grade).
   • Store the device between -65°C and +150°C.

6. Power Consumption:

   • Monitor the static power consumption, which is typically 100 mW at 25°C.
   • Manage dynamic power consumption, which can reach up to 1.2 W at 100 MHz with 50% utilization.

7. I/O Usage:

   • Distribute I/Os across the 16 banks, with a maximum of 27 I/Os per bank.
   • Ensure that each I/O pin is configured correctly for the intended use.

8. Timing:

   • Ensure that the internal and external clock frequencies do not exceed 300 MHz.
   • Account for the typical power-up time of 10 ms and configuration time of 10 ms (AS) or 20 ms (PS).

9. Multiplication:

   • Utilize the 128 dedicated 9-bit x 9-bit multipliers for high-speed arithmetic operations.

10. Logic Elements:

    • Design your logic using the 200,000 available logic elements (LEs).

11. User Flash Memory (UFM):

    • Use the 512 Kbits of UFM for storing configuration data or user-specific information.

12. Testing and Validation:

    • Perform thorough testing and validation to ensure the device meets the design requirements and operates reliably under all conditions.

(For reference only)