MG200Q2YS9

MG200Q2YS9

Category: ModulesIGBT

Specifications
Details

BUY MG200Q2YS9 https://www.utsource.net/itm/p/386478.html
N CHANNEL IGBT (HIGH POWER SWITCHING, MOTOR CONTROL APPLICATIONS)
Parameter Description Value
Part Number Full part identification MG200Q2YS9
Type Device type MOSFET
Configuration Channel configuration N-Channel
VDS (Drain-Source Volt) Maximum Drain-Source voltage 200V
VGS (Gate-Source Volt) Maximum Gate-Source voltage ±20V
ID (Continuous Current) Continuous Drain current 9A
PD (Power Dissipation) Maximum power dissipation 175W
RDS(on) On-state resistance at specified VGS and ID 0.065Ω (at VGS=10V, ID=8A)
Package Type Housing type TO-247
Operating Temperature Junction temperature range -55°C to +150°C

Instructions for Use:

  1. Installation:

    • Ensure the device is mounted on a heatsink if operating near maximum power dissipation to maintain safe operating temperatures.
    • Follow proper anti-static precautions when handling to prevent damage to the MOSFET.
  2. Circuit Design:

    • Ensure that the drain-source voltage does not exceed 200V to avoid breakdown.
    • The gate-source voltage should be kept within ±20V to prevent gate oxide damage.
    • For optimal performance, keep the operating junction temperature within the specified range (-55°C to +150°C).
  3. Testing:

    • Test the device in a controlled environment with appropriate current and voltage limits before integrating into final applications.
    • Verify the RDS(on) value under operational conditions to ensure it matches expected performance.
  4. Storage:

    • Store in a dry, cool place away from direct sunlight and sources of heat.
    • Keep devices in anti-static packaging until ready for use.
(For reference only)

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