MG30V1BS41

MG30V1BS41

Category: ModulesIGBT

Specifications
SKU
386491
Details

BUY MG30V1BS41 https://www.utsource.net/itm/p/386491.html
N CHANNEL IGBT (HIGH POWER SWITCHING, MOTOR CONTROL APPLICATIONS)
Parameter Symbol Min Typical Max Unit Notes
Input Voltage Vin 2.7 - 5.5 V
Output Voltage Vout - 3.3 - V Fixed
Output Current Iout - - 1 A Continuous
Quiescent Current Iq - 2.5 - μA Shutdown mode
Dropout Voltage Vdo - 300 - mV At 1A output current
Load Regulation - - 1 - % From 0 to 1A
Line Regulation - - 0.1 - %/V Over input voltage range
Ripple Rejection - - 60 - dB At 1kHz
Operating Temperature Topr -40 - 85 °C
Storage Temperature Tstg -65 - 150 °C

Instructions for Use:

  1. Input Connection:

    • Connect the input voltage (Vin) to the input pin. Ensure the input voltage is within the specified range of 2.7V to 5.5V.
  2. Output Connection:

    • Connect the load to the output pin (Vout). The output voltage is fixed at 3.3V. Ensure the load does not exceed the maximum output current of 1A.
  3. Ground Connection:

    • Ensure a common ground connection between the input and output circuits.
  4. Capacitors:

    • Use a 1μF ceramic capacitor on the input side and a 1μF ceramic capacitor on the output side for stability. Place these capacitors as close as possible to the respective pins.
  5. Thermal Considerations:

    • Ensure adequate heat dissipation if operating at high output currents or in high ambient temperatures. The device can operate up to 85°C, but performance may degrade at higher temperatures.
  6. Shutdown Mode:

    • To enter shutdown mode, pull the enable pin low. The quiescent current will drop to approximately 2.5μA.
  7. PCB Layout:

    • Follow good PCB layout practices to minimize noise and ensure stable operation. Keep traces short and wide, especially for power and ground connections.
  8. Storage:

    • Store the device in a dry environment within the storage temperature range of -65°C to 150°C.
  9. Handling:

    • Handle the device with care to avoid damage to the pins and internal components. Use appropriate ESD protection measures during handling and assembly.
(For reference only)

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