MG25Q6ES50

MG25Q6ES50

Category: ModulesIGBT

Specifications
Details

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N CHANNEL IGBT HIGH POWER SWITCHING, MOTOR CONTROL APPLICATIONS
Parameter Description Value Unit
Storage Capacity Total memory storage capacity 64 Mbit
Operating Voltage Supply voltage range for operation 2.7 to 3.6 V
Operating Temperature Temperature range for reliable operation -40 to +85 °C
Package Type Type of package SOP8
Data Retention Duration data can be retained without power 20 years
Endurance Cycles Number of program/erase cycles the device can endure 100,000 cycles
Access Time Maximum time required to access data 70 ns
Organization Memory organization 8M x 8 bits

Instructions for Use:

  1. Power Supply Connection:

    • Connect the VCC pin to a stable power supply within the operating voltage range (2.7V to 3.6V).
    • Ensure the GND pin is properly grounded.
  2. Initialization:

    • After powering up, allow a brief stabilization period before initiating any commands or data transfers.
  3. Command Execution:

    • Use standard SPI commands to read from, write to, and erase memory sectors.
    • Refer to the specific command set provided in the datasheet for detailed instruction codes.
  4. Write Operations:

    • Before writing, ensure the Write Enable Latch (WEL) bit is set using the Write Enable (WREN) command.
    • After each write or erase command, wait until the device is no longer busy (check the status register).
  5. Read Operations:

    • Initiate read operations by sending the appropriate read command followed by the address and dummy cycles if necessary.
    • Capture data on the rising edge of the clock signal.
  6. Handling Power Loss:

    • Implement proper power management to avoid data corruption during unexpected power loss.
    • Consider using capacitors or backup batteries if the application requires high reliability.
  7. Storage and Handling:

    • Store the device in an environment within the specified temperature range when not in use.
    • Handle with care to avoid electrostatic discharge (ESD), which can damage the component.
(For reference only)

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