MG300Q1US51

MG300Q1US51

Category: ModulesIGBT

Specifications
Details

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Silicon N channel IGBTN
Parameter Description
Part Number MG300Q1US51
Type MOSFET (Metal-Oxide-Semiconductor Field-Effect Transistor)
Configuration N-Channel
VDS (Max Drain-Source Voltage) 30V
RDS(on) (On-Resistance) 4.5 mΩ @ VGS = 10V, ID = 80A
ID (Continuous Drain Current) 96A @ Tc = 25°C
Power Dissipation (PD) 170W @ TC = 25°C
Gate Charge (Qg) 160 nC
Total Gate Charge (Qgtot) 190 nC
Input Capacitance (Ciss) 4540 pF
Output Capacitance (Coss) 960 pF
Reverse Transfer Capacitance (Crss) 680 pF
Operating Temperature Range -55°C to +175°C
Package Type TO-247

Instructions for Use:

  1. Mounting: Ensure the device is securely mounted on a heatsink or PCB with adequate thermal management to handle the power dissipation.
  2. Biasing: Apply gate-source voltage (VGS) within specified limits to control the drain current (ID). Avoid exceeding the maximum ratings.
  3. Handling Precautions: Handle with care as ESD (Electrostatic Discharge) sensitive device. Use appropriate ESD protection measures.
  4. Thermal Considerations: Monitor operating temperature and ensure it remains within the specified range to avoid thermal runaway.
  5. Polarity Awareness: Connect the device ensuring correct polarity; incorrect connections can lead to immediate failure.
  6. Storage Conditions: Store in original packaging away from moisture and extreme temperatures.
  7. Testing: Perform initial testing under controlled conditions to verify proper operation before full-scale deployment.
(For reference only)

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