Details

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Electrically-Erasable PLD

Parameter	Symbol	Min	Typ	Max	Unit	Notes
Operating Voltage	VCC	4.5	-	5.5	V
Output Current (Source)	IOH	-	4	10	mA	At VOH = 2.4V, VCC = 5V
Output Current (Sink)	IOL	-	8	15	mA	At VOL = 0.4V, VCC = 5V
Input Leakage Current	IIL	-1	0	1	μA	At VCC = 5V
Propagation Delay Time	tp	-	15	25	ns	Typical at VCC = 5V, TA = 25°C
Power Dissipation	PD	-	-	500	mW	Maximum at TA = 70°C
Operating Temperature	TA	-40	-	85	°C
Storage Temperature	TSTG	-65	-	150	°C

Instructions:

1. Power Supply:

   • Ensure the supply voltage (V_CC) is within the range of 4.5V to 5.5V.
   • Use appropriate decoupling capacitors (e.g., 0.1μF ceramic capacitor) close to the power pins to reduce noise and stabilize the power supply.

2. Input Handling:

   • Keep input currents within the specified leakage current limits to avoid damage.
   • Ensure all inputs are either tied to a valid logic level (0V or V_CC) or use pull-up/pull-down resistors to prevent floating inputs.

3. Output Handling:

   • Do not exceed the maximum output current ratings for both sourcing and sinking.
   • Use external current-limiting resistors if driving high-current loads.

4. Timing Considerations:

   • Account for the propagation delay time when designing your circuit to ensure proper timing and synchronization.
   • Test the device at different temperatures to verify performance stability.

5. Thermal Management:

   • Ensure adequate cooling if operating near the maximum power dissipation limit.
   • Avoid prolonged exposure to temperatures outside the operating temperature range.

6. Storage:

   • Store the device in a dry, cool environment to prevent damage from moisture and extreme temperatures.
   • Handle with care to avoid mechanical stress on the package.

7. ESD Protection:

   • Use proper ESD protection measures when handling the device to prevent damage from static electricity.

8. Soldering:

   • Follow recommended soldering profiles to avoid thermal shock and ensure reliable connections.
   • Inspect solder joints for quality and integrity after assembly.

(For reference only)