Details

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BUY LM111J-8 https://www.utsource.net/itm/p/525760.html
Multiconductor Cable; Number of Conductors:3; Conductor Size AWG:14; No. Strands x Strand Size:41 x 30; Jacket Material:EPDM Rubber; Jacket Color:Black; Leaded Process Compatible:Yes; Outer Diameter:0.380"; Temperature Max:60 C RoHS Compliant: Yes

Parameter	Symbol	Conditions	Min	Typ	Max	Unit
Supply Voltage	VCC	-	2.0	5.0	36	V
Operating Temperature	TA	-	-40		85	°C
Differential Input Voltage	VID	-	±30			V
Common-Mode Input Voltage	VCM	-	-0.3		VCC+0.3	V
Output Voltage Swing	VOUT	No Load	0.1		VCC-0.1	V
Quiescent Current	IQ	VCC=5V	1.0	1.5	2.0	mA
Input Offset Voltage	VOS	-	±2		±5	mV
Input Bias Current	IB	-	±50		±250	nA
Input Offset Current	IOS	-	±5		±25	nA
Slew Rate	SR	-	0.5	1.0	2.0	V/μs
Bandwidth (Unity Gain)	fu	-	1.0	1.5	2.0	MHz
Large Signal Voltage Gain	AV	-	70	100	150	dB

Instructions for Using the LM111J-8:

1. Power Supply:

   • Ensure the supply voltage (V_CC) is within the range of 2.0V to 36V.
   • Use appropriate decoupling capacitors (e.g., 0.1μF and 10μF) close to the power pins to stabilize the supply.

2. Input Signals:

   • The differential input voltage (V_ID) should not exceed ±30V.
   • The common-mode input voltage (V_CM) must be within the range of -0.3V to V_CC + 0.3V.

3. Output Configuration:

   • The output voltage swing (V_OUT) can range from 0.1V to V_CC - 0.1V under no load conditions.
   • For optimal performance, ensure the load resistance is suitable for the output current requirements.

4. Biasing and Offsets:

   • The input bias current (I_B) and input offset current (I_OS) are very low but should be considered in high-precision applications.
   • The input offset voltage (V_OS) can vary between ±2mV and ±5mV, which may affect precision measurements.

5. Frequency Response:

   • The unity gain bandwidth (f_u) is typically around 1.5MHz, with a large signal voltage gain (A_V) of about 100dB.

6. Thermal Management:

   • Operate the device within the temperature range of -40°C to 85°C.
   • If operating at high temperatures or with high power dissipation, consider thermal management techniques such as heatsinks or forced air cooling.

7. Handling and Storage:

   • Handle the device with care to avoid static damage.
   • Store in a dry environment to prevent moisture-related issues.

8. Application Notes:

   • Refer to the datasheet and application notes for detailed information on specific circuit configurations and troubleshooting tips.

(For reference only)