Details

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BUY LM2903DR2G https://www.utsource.net/itm/p/545913.html
Low Offset Voltage Dual Comparators

Parameter	Symbol	Min	Typical	Max	Unit	Conditions
Supply Voltage	VCC	2.0	-	36	V	-
Input Voltage Range	VI	0	-	VCC - 1.5	V	-
Output Voltage (Open-Collector)	VO	0	-	0.4	V	IO = 8 mA
Output Current (Sink)	IO	-	8	16	mA	VO = 0.4 V
Quiescent Current	IQ	10	35	60	μA	VCC = 5 V, no load
Input Offset Voltage	VOS	0.5	2.0	5.0	mV	VCC = 5 V
Input Bias Current	IB	25	100	300	nA	VCC = 5 V
Input Leakage Current	ILK	-10	0	10	nA	VCC = 5 V
Common-Mode Input Voltage Range	VCM	0	-	VCC - 1.5	V	-
Differential Input Voltage Range	VDIFF	-0.3	-	VCC + 0.3	V	-
Output Low Voltage	VOL	0	-	0.4	V	IO = 8 mA
Output High Voltage	VOH	-	VCC - 0.4	VCC	V	-
Operating Temperature	TA	-40	-	125	°C	-
Storage Temperature	TSTG	-65	-	150	°C	-

Instructions for Use:

1. Power Supply:

   • The LM2903DR2G can operate with a supply voltage ranging from 2.0 V to 36 V. Ensure the supply voltage is within this range to avoid damage to the device.

2. Input Voltage:

   • The input voltage should be within the range of 0 V to V_CC - 1.5 V. Exceeding these limits can cause the device to malfunction or be damaged.

3. Output Configuration:

   • The output is open-collector, meaning it can sink current but not source it. Use an external pull-up resistor to set the high output level. The typical value for the pull-up resistor can be calculated based on the desired output high voltage and the maximum output current.

4. Quiescent Current:

   • The quiescent current is relatively low, typically around 35 μA at 5 V. This makes the LM2903DR2G suitable for low-power applications.

5. Input Offset Voltage:

   • The input offset voltage can vary between 0.5 mV and 5.0 mV. This should be considered when designing precision circuits.

6. Temperature Range:

   • The operating temperature range is from -40°C to 125°C, making it suitable for a wide range of environmental conditions.

7. Storage Temperature:

   • Store the device in a temperature range from -65°C to 150°C to ensure its longevity and performance.

8. Handling:

   • Handle the device with care to avoid static discharge, which can damage the internal components. Use proper ESD protection measures.

9. Mounting:

   • Follow the recommended PCB layout and mounting guidelines to ensure optimal performance and reliability. Proper thermal management is crucial, especially in high-temperature environments.

10. Testing:

    • Before deploying the device in a final application, test it under various conditions to ensure it meets the required specifications and performance criteria.

(For reference only)