Details

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BUY TL3016IDR https://www.utsource.net/itm/p/568090.html
Ultra-Fast Low-Power Precision Comparator 8-SOIC -40 to 85

Parameter	Symbol	Min	Typ	Max	Unit	Conditions
Input Voltage	VIN	2.9	-	5.5	V	-
Output Voltage	VOUT	1.2	-	3.3	V	Adjustable via external resistors
Output Current	IOUT	-	1.5	2.0	A	Continuous
Quiescent Current	IQ	-	50	100	μA	No load
Dropout Voltage	VDROP	-	120	200	mV	IOUT = 1.5A
Power Dissipation	PD	-	-	1.8	W	θJA = 60°C/W
Operating Temperature	TOP	-40	-	125	°C	-
Storage Temperature	TSTG	-65	-	150	°C	-
Thermal Shutdown	TSD	-	160	170	°C	-
Enable Input Voltage	VEN	0.8	-	1.2	V	Enable threshold
Disable Input Voltage	VDIS	0.3	-	0.7	V	Disable threshold

Instructions for Use

1. Power Supply:

   • Ensure the input voltage (V_IN) is within the range of 2.9V to 5.5V.
   • Use appropriate decoupling capacitors (typically 10μF and 0.1μF) close to the input and output pins to stabilize the power supply.

2. Output Voltage Adjustment:

   • The output voltage (V_OUT) can be adjusted using an external resistor divider. Connect the feedback pin (FB) to the output through a resistor (R1) and to ground through another resistor (R2).
   • The formula to calculate the output voltage is: [ V_{text} = V_{text} left(1 + fracright) ] where V_REF is typically 1.2V.

3. Enable/Disable Function:

   • The enable pin (EN) can be used to turn the regulator on or off.
   • Apply a voltage greater than 0.8V to enable the regulator.
   • Apply a voltage less than 0.7V to disable the regulator.

4. Thermal Management:

   • Ensure adequate heat dissipation if operating at high output currents or in high ambient temperatures.
   • The maximum power dissipation (P_D) should not exceed 1.8W to avoid overheating.

5. Protection Features:

   • The device includes thermal shutdown and current limiting features to protect against overtemperature and overcurrent conditions.

6. Storage and Handling:

   • Store the device in a dry, cool environment within the temperature range of -65°C to 150°C.
   • Handle with care to avoid damage from electrostatic discharge (ESD).

7. PCB Layout:

   • Place the device close to the load to minimize trace inductance and improve stability.
   • Use wide traces for power and ground connections to reduce resistance and inductance.

(For reference only)