Details

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BUY CD4541BCN https://www.utsource.net/itm/p/603154.html
Programmable Timer; Package: DIP; No of Pins: 14; Container: Rail

Parameter	Symbol	Conditions	Min	Typical	Max	Unit
Supply Voltage	VDD	-	3.0	-	18.0	V
Input High Voltage	VIH	II = -1 μA	0.7VDD	-	VDD	V
Input Low Voltage	VIL	II = 1 μA	0	-	0.3VDD	V
Output High Voltage	VOH	IO = -1 mA, VDD = 5 V	2.4	-	VDD - 0.1	V
Output Low Voltage	VOL	IO = 16 mA, VDD = 5 V	0	-	0.4	V
Propagation Delay Time	tpd	VDD = 5 V, fCLK = 1 MHz	35	-	70	ns
Power Dissipation	PD	Continuous	-	-	100	mW
Operating Temperature Range	TA	-	-40	-	85	°C
Storage Temperature Range	TSTG	-	-65	-	150	°C

Instructions for Use:

1. Power Supply:

   • Ensure the supply voltage (V_DD) is within the specified range of 3.0 V to 18.0 V.
   • Connect the ground (V_SS) to the appropriate ground reference.

2. Input Signals:

   • Input signals should be within the valid input voltage levels (V_IH and V_IL).
   • Avoid applying voltages outside the specified range to prevent damage to the device.

3. Output Signals:

   • Ensure that the output loads do not exceed the maximum current ratings to avoid excessive power dissipation.
   • The output high and low voltages (V_OH and V_OL) should be within the specified limits for reliable operation.

4. Propagation Delay:

   • The propagation delay time (t_pd) is crucial for timing considerations. Ensure that the clock frequency (f_CLK) is within the specified range to meet the required delay times.

5. Temperature Considerations:

   • Operate the device within the specified operating temperature range (-40°C to 85°C) to ensure reliable performance.
   • Store the device within the storage temperature range (-65°C to 150°C) to prevent damage during non-operational periods.

6. Handling:

   • Handle the device with care to avoid static discharge, which can damage the internal circuits.
   • Follow proper handling procedures to prevent mechanical stress or damage to the pins.

7. Mounting:

   • Ensure proper mounting on the PCB to maintain good electrical connections and thermal management.
   • Use appropriate soldering techniques to avoid overheating the device during assembly.

(For reference only)