DM74LS273WM

DM74LS273WM

Category: IC Chips

Specifications
Details

BUY DM74LS273WM https://www.utsource.net/itm/p/641594.html

Parameter Symbol Conditions Min Typ Max Unit
Supply Voltage Vcc 4.75 5.25 V
Output High Level Voltage VOH IOL = -0.4mA 2.4 Vcc-0.5 V
Output Low Level Voltage VOL IOH = 8mA 0.5 V
Input Leakage Current IIH VI = 2V -1 1 μA
Input Leakage Current IIL VI = 0.8V -1 1 μA
Propagation Delay Time tpd Vcc = 5V, TA = 25°C 9 36 ns
Power Dissipation PD Per Package 360 mW

Instructions for Use:

  1. Power Supply:

    • Ensure the supply voltage (Vcc) is within the specified range of 4.75V to 5.25V.
  2. Input Signals:

    • Apply input signals that are compatible with TTL logic levels.
    • Be aware of input leakage currents which should not exceed ±1μA at typical operating conditions.
  3. Output Load:

    • When sourcing current (output high), ensure the load does not exceed the maximum output high level voltage.
    • When sinking current (output low), ensure the load keeps the output within the specified low-level voltage range.
  4. Timing Considerations:

    • Account for the propagation delay time in your circuit design to avoid timing issues. The typical propagation delay is around 9ns under standard conditions.
  5. Thermal Management:

    • Monitor power dissipation to ensure it does not exceed 360mW per package to prevent overheating and potential damage.
  6. Handling Precautions:

    • Handle the DM74LS273WM carefully as ESD (Electrostatic Discharge) can damage the device.
    • Avoid exceeding absolute maximum ratings as this can lead to permanent damage.
  7. Storage:

    • Store in a dry, cool environment and follow anti-static storage practices to maintain device integrity.
(For reference only)

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