Details

---

BUY 74HC244PW,118 https://www.utsource.net/itm/p/825301.html
Octal buffer, line driver; 3-state - Description: Octal Buffer/Line Driver; Non-Inverting 3-State ; Logic switching levels: CMOS ; Number of pins: 20 ; Output drive capability: +/- 7.8 mA ; Power dissipation considerations: Low Power or Battery Applications ; Propagation delay: 9 ns; Voltage: 2.0-6.0 V; Package: SOT360-1 TSSOP20; Container: Reel Pack, SMD, 13"

Parameter	Symbol	Min	Typ	Max	Unit	Conditions
Supply Voltage	VCC	2.0	-	6.0	V
Input Low Voltage	VIL	-	-	1.5	V	VCC = 4.5V to 5.5V
Input High Voltage	VIH	3.5	-	-	V	VCC = 4.5V to 5.5V
Output Low Voltage	VOL	0	0.1	0.2	V	IOL = 4mA
Output High Voltage	VOH	4.4	4.5	4.6	V	IOH = -0.4mA
Input Current	IIN	-1	0	1	μA	VIN = 0V to VCC
Output Current (Low Level)	IOL	-	-	-8	mA	VOL = 0.4V
Output Current (High Level)	IOH	-	-	-4	mA	VOH = 4.4V
Propagation Delay Time	tpd	-	9	22	ns	VCC = 5V, TA = 25°C
Power Dissipation	Ptot	-	-	100	mW	Per Package

Instructions for 74HC244PW,118

1. Power Supply:

   • Ensure the supply voltage (V_CC) is within the range of 2.0V to 6.0V.
   • Connect V_CC to the positive power supply and GND to the ground.

2. Input Signals:

   • Input signals should be within the valid logic levels:
     • Low level (V_IL): 0V to 1.5V
     • High level (V_IH): 3.5V to V_CC
   • Ensure input currents do not exceed ±1μA to avoid damage.

3. Output Signals:

   • Output low voltage (V_OL) should be less than or equal to 0.2V when sourcing up to 4mA.
   • Output high voltage (V_OH) should be greater than or equal to 4.4V when sinking up to -0.4mA.
   • Do not exceed the maximum output current ratings:
     • Low level (I_OL): -8mA
     • High level (I_OH): -4mA

4. Propagation Delay:

   • The propagation delay time (t_pd) is typically 9ns at 5V and 25°C, with a maximum of 22ns.

5. Power Dissipation:

   • The total power dissipation (P_tot) per package should not exceed 100mW to prevent overheating.

6. Handling:

   • Handle the device with care to avoid static discharge, which can damage the internal circuits.
   • Use appropriate ESD protection measures during handling and assembly.

7. Storage:

   • Store the device in a dry, cool place away from direct sunlight and extreme temperatures.

8. Soldering:

   • Use a soldering iron with a temperature not exceeding 300°C and complete the soldering process within 10 seconds to avoid thermal damage.

By following these parameters and instructions, you can ensure reliable operation and longevity of the 74HC244PW,118 IC.

(For reference only)