MM74HC244MTCX
Specifications
SKU
833147
Details
BUY MM74HC244MTCX https://www.utsource.net/itm/p/833147.html
Octal 3-STATE Buffer; Package: TSSOP; No of Pins: 20; Container: Tape & Reel
| Parameter | Symbol | Min | Typical | Max | Unit | Notes |
|---|---|---|---|---|---|---|
| Supply Voltage | VCC | 2.0 | - | 6.0 | V | |
| Input Voltage (Low) | VIL | - | 0.8 | - | V | |
| Input Voltage (High) | VIH | - | 2.0 | - | V | |
| Output Voltage (Low) | VOL | - | 0.1 | 0.4 | V | |
| Output Voltage (High) | VOH | 2.4 | - | 5.0 | V | |
| Input Leakage Current | IIL | -1 | - | 1 | μA | |
| Output Leakage Current | IOL | -1 | - | 1 | μA | |
| Propagation Delay Time | tpd | - | 6 | 18 | ns | |
| Power Dissipation | PD | - | - | 100 | mW | |
| Operating Temperature Range | TA | -40 | - | 85 | °C | |
| Storage Temperature Range | TSTG | -65 | - | 150 | °C |
Instructions for Use
Supply Voltage:
- Ensure the supply voltage (VCC) is within the range of 2.0V to 6.0V to avoid damage to the device.
Input Levels:
- Inputs should be driven to either a low level (VIL ≤ 0.8V) or a high level (VIH ≥ 2.0V) to ensure proper operation.
Output Levels:
- When the output is low, it will typically be around 0.1V (VOL). When high, it will be at least 2.4V (VOH).
Leakage Current:
- Both input and output leakage currents should be kept below ±1μA to prevent unwanted behavior.
Propagation Delay:
- The typical propagation delay time (tpd) is 6ns, with a maximum of 18ns. This is important for timing considerations in your circuit.
Power Dissipation:
- The device can dissipate up to 100mW of power. Ensure adequate heat dissipation if operating near this limit.
Temperature Ranges:
- The operating temperature range is from -40°C to 85°C. The storage temperature range is from -65°C to 150°C.
Handling:
- Handle the device with care to avoid static discharge, which can damage sensitive components. Use appropriate ESD protection measures.
Mounting:
- Follow recommended soldering profiles and mounting guidelines to ensure reliable connections and prevent thermal stress on the device.
Testing:
- After assembly, perform functional tests to verify that the device is operating correctly according to the specified parameters.
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