Details
BUY 74ACT574PC https://www.utsource.net/itm/p/847884.html
Octal D-Type Flip-Flop with 3-STATE Outputs; Package: DIP; No of Pins: 20; Container: Rail
Parameter | Symbol | Min | Typ | Max | Unit | Notes |
---|---|---|---|---|---|---|
Supply Voltage | VCC | 2.0 | - | 5.5 | V | - |
Input Low Voltage | VIL | - | 0.8 | 1.5 | V | - |
Input High Voltage | VIH | 3.5 | - | 5.5 | V | - |
Output Low Voltage | VOL | 0 | 0.1 | 0.4 | V | - |
Output High Voltage | VOH | 4.5 | - | VCC - 0.5 | V | - |
Input Leakage Current | IIL | - | - | ±1.0 | μA | - |
Output Leakage Current | IOL | - | - | ±1.0 | μA | - |
Propagation Delay Time | tpd | 3 | 5 | 7 | ns | - |
Power Dissipation | PD | - | - | 100 | mW | - |
Operating Temperature | TA | -40 | - | 85 | °C | - |
Storage Temperature | TSTG | -65 | - | 150 | °C | - |
Instructions for Use
Supply Voltage (VCC):
- Ensure the supply voltage is within the range of 2.0V to 5.5V to avoid damage to the device.
Input Voltages (VIL, VIH):
- For a logic low, the input voltage should be between 0V and 1.5V.
- For a logic high, the input voltage should be between 3.5V and VCC.
Output Voltages (VOL, VOH):
- The output low voltage should not exceed 0.4V.
- The output high voltage should be at least 4.5V or VCC - 0.5V, whichever is lower.
Leakage Currents (IIL, IOL):
- Ensure that the leakage currents do not exceed ±1.0 μA to maintain proper operation.
Propagation Delay Time (tpd):
- The propagation delay time is typically between 3ns and 7ns. This is the time it takes for the output to respond to a change in the input.
Power Dissipation (PD):
- The maximum power dissipation is 100mW. Ensure adequate heat sinking if operating near this limit.
Operating Temperature (TA):
- The device is designed to operate in temperatures ranging from -40°C to 85°C.
Storage Temperature (TSTG):
- Store the device in temperatures ranging from -65°C to 150°C to prevent damage.
Handling:
- Handle with care to avoid static discharge, which can damage the device. Use proper ESD protection measures.
Mounting:
- Follow recommended soldering profiles to ensure reliable connections and avoid thermal stress.
Testing:
- Perform functional tests under specified operating conditions to verify correct operation.
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