74ACT574PC

74ACT574PC

Category: IC Chips

Specifications
SKU
847884
Details

BUY 74ACT574PC https://www.utsource.net/itm/p/847884.html
Octal D-Type Flip-Flop with 3-STATE Outputs; Package: DIP; No of Pins: 20; Container: Rail
Parameter Symbol Min Typ Max Unit Notes
Supply Voltage VCC 2.0 - 5.5 V -
Input Low Voltage VIL - 0.8 1.5 V -
Input High Voltage VIH 3.5 - 5.5 V -
Output Low Voltage VOL 0 0.1 0.4 V -
Output High Voltage VOH 4.5 - VCC - 0.5 V -
Input Leakage Current IIL - - ±1.0 μA -
Output Leakage Current IOL - - ±1.0 μA -
Propagation Delay Time tpd 3 5 7 ns -
Power Dissipation PD - - 100 mW -
Operating Temperature TA -40 - 85 °C -
Storage Temperature TSTG -65 - 150 °C -

Instructions for Use

  1. Supply Voltage (VCC):

    • Ensure the supply voltage is within the range of 2.0V to 5.5V to avoid damage to the device.
  2. Input Voltages (VIL, VIH):

    • For a logic low, the input voltage should be between 0V and 1.5V.
    • For a logic high, the input voltage should be between 3.5V and VCC.
  3. Output Voltages (VOL, VOH):

    • The output low voltage should not exceed 0.4V.
    • The output high voltage should be at least 4.5V or VCC - 0.5V, whichever is lower.
  4. Leakage Currents (IIL, IOL):

    • Ensure that the leakage currents do not exceed ±1.0 μA to maintain proper operation.
  5. Propagation Delay Time (tpd):

    • The propagation delay time is typically between 3ns and 7ns. This is the time it takes for the output to respond to a change in the input.
  6. Power Dissipation (PD):

    • The maximum power dissipation is 100mW. Ensure adequate heat sinking if operating near this limit.
  7. Operating Temperature (TA):

    • The device is designed to operate in temperatures ranging from -40°C to 85°C.
  8. Storage Temperature (TSTG):

    • Store the device in temperatures ranging from -65°C to 150°C to prevent damage.
  9. Handling:

    • Handle with care to avoid static discharge, which can damage the device. Use proper ESD protection measures.
  10. Mounting:

    • Follow recommended soldering profiles to ensure reliable connections and avoid thermal stress.
  11. Testing:

    • Perform functional tests under specified operating conditions to verify correct operation.
(For reference only)

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