Details

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BUY MM5453N/NOPB https://www.utsource.net/itm/p/860758.html

Parameter	Symbol	Conditions	Min	Typ	Max	Unit
Supply Voltage	Vcc		2.7	5	5.5	V
Operating Temperature	Toper		-40		85	°C
Storage Temperature	Tstg		-65		150	°C
Output Current (Source)	Iout	per output, Vout = 0.1V		20		mA
Output Current (Sink)	Iout	per output, Vout = 0.9V		20		mA
Quiescent Current	IQ	Vcc = 5V		0.1	1	mA
Output Low Voltage	VOL	Iout = 20mA, Vcc = 5V		0.1	0.3	V
Output High Voltage	VOH	Iout = -20mA, Vcc = 5V	4.7		5	V
Input High Voltage	VIH		2		5.5	V
Input Low Voltage	VIL		0		0.8	V
Propagation Delay Time	tpd	Vcc = 5V, RL = 150Ω		8	12	ns
Power Dissipation	Ptot	Ta = 25°C			125	mW

Instructions for Use:

1. Supply Voltage:

   • Ensure the supply voltage is within the range of 2.7V to 5.5V to avoid damage to the device.

2. Operating and Storage Temperature:

   • The device can operate between -40°C and 85°C and can be stored between -65°C and 150°C.

3. Output Current:

   • Each output can source or sink up to 20mA of current. Ensure that the load does not exceed this limit to prevent damage.

4. Quiescent Current:

   • The quiescent current is typically 0.1mA at 5V supply, but it can go up to 1mA. This should be considered in low-power applications.

5. Output Voltage Levels:

   • When sourcing current, the output high voltage (VOH) should be at least 4.7V at 5V supply.
   • When sinking current, the output low voltage (VOL) should be no more than 0.3V at 5V supply.

6. Input Voltage Levels:

   • The input high voltage (VIH) should be at least 2V and can go up to 5.5V.
   • The input low voltage (VIL) should be no more than 0.8V.

7. Propagation Delay:

   • The propagation delay time (tpd) is typically 8ns and can be up to 12ns at 5V supply with a 150Ω load.

8. Power Dissipation:

   • The total power dissipation should not exceed 125mW at 25°C ambient temperature.

9. Handling:

   • Handle the device with care to avoid static discharge, which can damage the internal circuits. Use proper ESD protection when handling the device.

10. Mounting:

    • Ensure proper mounting and soldering techniques to avoid mechanical stress on the device. Follow the recommended footprint and soldering profile provided by the manufacturer.

11. Testing:

    • Before finalizing the design, test the device under all expected operating conditions to ensure reliable performance.

12. Compliance:

    • Ensure that the device meets all relevant safety and regulatory standards for the application.

(For reference only)