Details

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BUY CY62147EV30LL-45ZSXI https://www.utsource.net/itm/p/863133.html
4-Mbit (256K x 16) Static RAM

Parameter	Value
Manufacturer	Cypress Semiconductor
Part Number	CY62147EV30LL-45ZSXI
Description	1M x 16-bit SRAM, Low Power
Package Type	TSSOP (Thin Small Outline)
Number of Pins	44
Supply Voltage (Vcc)	3.3V
Operating Temperature	-40°C to +85°C
Access Time	45 ns
Data Retention	20 years at 25°C
Standby Current	5 μA (typical)
Active Current	20 mA (typical)
Write Cycle Time	45 ns
Output Drive Strength	12 mA (typical)
Package Material	Lead-Free
RoHS Compliant	Yes

Instructions for Use:

1. Power Supply:

   • Ensure that the supply voltage is within the specified range (3.3V).
   • Use decoupling capacitors (typically 0.1 μF and 10 μF) close to the Vcc and GND pins to reduce noise.

2. Signal Levels:

   • All input signals should be within the valid logic levels for the supply voltage.
   • Output signals will be rail-to-rail (0V to 3.3V).

3. Addressing:

   • The device has 20 address lines (A0-A19) to access the 1M x 16-bit memory space.
   • Address lines should be stable before the rising edge of the clock signal.

4. Data Input/Output:

   • Data is read from or written to the device via the 16 data lines (DQ0-DQ15).
   • During a write operation, ensure that the data lines are stable before the rising edge of the clock signal.

5. Control Signals:

   • /CE (Chip Enable): Active low. When low, the chip is enabled and can respond to read/write operations.
   • /OE (Output Enable): Active low. When low, the output buffers are enabled during a read operation.
   • /WE (Write Enable): Active low. When low, a write operation is performed.
   • /UB (Upper Byte Enable): Active low. When low, the upper byte (DQ8-DQ15) is enabled.
   • /LB (Lower Byte Enable): Active low. When low, the lower byte (DQ0-DQ7) is enabled.

6. Timing:

   • Ensure that all timing parameters, such as setup and hold times, are met for reliable operation.
   • Refer to the datasheet for detailed timing diagrams and specifications.

7. Handling:

   • Handle the device with care to avoid damage from electrostatic discharge (ESD).
   • Store the device in an ESD-safe environment when not in use.

8. Mounting:

   • Follow the recommended PCB layout guidelines to ensure proper thermal management and signal integrity.
   • Use appropriate soldering techniques to avoid damage to the device during assembly.

For more detailed information, refer to the official datasheet provided by Cypress Semiconductor.

(For reference only)