Details

---

BUY IX6R11S6 https://www.utsource.net/itm/p/1029790.html
6A Half-Bridge Driver

Parameter	Symbol	Min	Typical	Max	Unit	Notes
Input Voltage	VIN	4.5	-	30	V
Output Voltage	VOUT	-	12	-	V	Fixed
Output Current	IOUT	-	1.1	-	A	Continuous
Efficiency	η	-	90	-	%	Typical at nominal conditions
Switching Frequency	fSW	-	600	-	kHz
Quiescent Current	IQ	-	30	-	μA	Shutdown mode
Operating Temperature	TOPR	-40	-	125	°C	Junction temperature
Storage Temperature	TSTG	-65	-	150	°C
Package	-	-	SO-8	-	-

Instructions for Use:

1. Input Voltage (VIN):

   • Ensure the input voltage is within the range of 4.5V to 30V.
   • Do not exceed the maximum input voltage to avoid damaging the device.

2. Output Voltage (VOUT):

   • The output voltage is fixed at 12V. No external components are required to set this voltage.

3. Output Current (IOUT):

   • The device can provide a continuous output current of up to 1.1A.
   • Ensure the load does not exceed this current to prevent overheating or damage.

4. Efficiency (η):

   • The typical efficiency is 90% under nominal operating conditions.
   • Efficiency may vary depending on the input voltage and load conditions.

5. Switching Frequency (fSW):

   • The switching frequency is fixed at 600kHz.
   • This frequency helps minimize the size of external components like inductors and capacitors.

6. Quiescent Current (IQ):

   • In shutdown mode, the quiescent current is typically 30μA.
   • This low current consumption helps extend battery life in portable applications.

7. Operating Temperature (TOPR):

   • The device can operate over a junction temperature range from -40°C to 125°C.
   • Ensure proper heat dissipation if operating at high temperatures.

8. Storage Temperature (TSTG):

   • Store the device in an environment with a temperature range from -65°C to 150°C.

9. Package:

   • The IX6R11S6 is packaged in an SO-8 package.
   • Follow standard PCB design guidelines for SO-8 packages to ensure reliable operation.

10. Layout Considerations:

    • Place the input and output capacitors as close as possible to the device to minimize parasitic inductance.
    • Use wide traces for power connections to reduce resistance and improve thermal performance.
    • Ensure adequate clearance between the device and other heat-generating components to prevent thermal issues.

(For reference only)