Details

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BUY XCV1000E-6BG560C https://www.utsource.net/itm/p/1066592.html
Virtex-E 1.8 V Field Programmable Gate Arrays

Below is the parameter table and instructions for the XCV1000E-6BG560C, which is a Xilinx Virtex-E FPGA.

Parameter Table

Parameter	Description	Value
Device Family	Family of FPGA	Virtex-E
Device Type	Specific device model	XCV1000E
Package	Package type	BG560C
Speed Grade	Speed grade of the device	-6
Logic Cells	Number of logic cells	1000
I/O Pins	Number of I/O pins	332
Block RAM	Amount of block RAM	320 kbits
Multipliers	Number of multipliers	8
Clock Managers	Number of clock managers	4
Operating Voltage (Vcc)	Supply voltage range	1.5V to 1.7V
I/O Voltage (Vcco)	I/O supply voltage range	1.5V to 3.3V
Configuration Memory	Configuration memory size	1.5 Mbits
Configuration Modes	Supported configuration modes	JTAG, Master/Slave SelectMAP, Boundary Scan
Temperature Range	Operating temperature range	-40°C to +85°C
Power Consumption	Typical power consumption	2.5W (static), 10W (dynamic)
Package Size	Physical dimensions of the package	35 mm x 35 mm
Pin Pitch	Pin pitch of the package	1.0 mm

Instructions

1. Handling and Storage

• ESD Protection: The XCV1000E-6BG560C is sensitive to electrostatic discharge (ESD). Use ESD protection equipment such as wrist straps, grounded work surfaces, and static-dissipative packaging.
• Storage Conditions: Store the device in a dry, cool environment with controlled humidity (less than 60%).

2. Power Supply Connections

• Vcc (Core Supply): Connect the core supply voltage (1.5V to 1.7V) to the Vcc pins.
• Vcco (I/O Supply): Connect the I/O supply voltage (1.5V to 3.3V) to the Vcco pins.
• Ground (GND): Ensure all ground connections are properly made to the GND pins.

3. Configuration

• JTAG Configuration: Use the JTAG interface for programming the device. Connect the TDI, TDO, TCK, and TMS pins to your JTAG programmer.
• SelectMAP Configuration: For SelectMAP configuration, connect the appropriate data, address, and control signals to the corresponding pins.
• Boundary Scan: Use boundary scan for testing and debugging by connecting the TDI, TDO, TCK, and TMS pins.

4. Signal Integrity

• Termination: Use proper termination techniques for high-speed signals to prevent reflections and ensure signal integrity.
• Decoupling Capacitors: Place decoupling capacitors close to the power supply pins to minimize noise and improve stability.

5. Thermal Management

• Heat Dissipation: Ensure adequate heat dissipation by using heat sinks or cooling solutions if the device operates at high power levels.
• Thermal Monitoring: Monitor the temperature of the device during operation to ensure it stays within the specified operating range.

6. Software Tools

• ISE Design Suite: Use Xilinx ISE Design Suite for design entry, synthesis, place and route, and bitstream generation.
• Data Sheets and User Guides: Refer to the Xilinx data sheets and user guides for detailed information on device specifications and design guidelines.

7. Testing and Debugging

• In-System Programming: Use in-system programming (ISP) to reprogram the device without removing it from the circuit.
• Boundary Scan Testing: Utilize boundary scan testing to verify the connectivity and functionality of the device.

By following these instructions, you can ensure the proper handling, configuration, and operation of the XCV1000E-6BG560C FPGA.

(For reference only)