Details

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BUY DP83907VF https://www.utsource.net/itm/p/1067568.html
PTB 32C 32#20 PIN/SKT RECP

Parameter	Description	Min	Typ	Max	Unit
Supply Voltage (VDD)	Operating supply voltage	2.25	-	3.6	V
I/O Voltage (VI/O)	Input/output voltage	1.2	-	3.6	V
Operating Temperature (TA)	Ambient operating temperature	-40	-	85	°C
Storage Temperature (TSTG)	Storage temperature range	-65	-	150	°C
Data Rate	Maximum data rate	-	100	-	Mbps
Output Current (IOL)	Output low current	-	4	-	mA
Output Current (IOH)	Output high current	-	-4	-	mA
Input Leakage Current (IIK)	Input leakage current	-	1	-	μA
Propagation Delay (tPD)	Propagation delay time	-	10	-	ns
Skew (tSKEW)	Skew between outputs	-	1	-	ns
Power Dissipation (Ptot)	Total power dissipation	-	-	500	mW

Instructions for Using DP83907VF

1. Power Supply:

   • Ensure the supply voltage (VDD) is within the specified range of 2.25V to 3.6V.
   • The I/O voltage (VI/O) should be set according to the system requirements, within the range of 1.2V to 3.6V.

2. Temperature Considerations:

   • Operate the device within the ambient temperature range of -40°C to 85°C.
   • Store the device within the storage temperature range of -65°C to 150°C.

3. Data Transmission:

   • The maximum data rate supported by the device is 100 Mbps. Ensure that the system clock and data rates are configured accordingly.

4. Current Specifications:

   • The output low current (IOL) is typically 4 mA.
   • The output high current (IOH) is typically -4 mA.
   • The input leakage current (IIK) is typically 1 μA.

5. Timing Parameters:

   • The propagation delay (tPD) is typically 10 ns.
   • The skew between outputs (tSKEW) is typically 1 ns.

6. Power Management:

   • The total power dissipation (Ptot) should not exceed 500 mW. Ensure proper heat dissipation and cooling mechanisms are in place if operating near the maximum power dissipation.

7. Layout and PCB Design:

   • Use appropriate PCB layout techniques to minimize noise and interference.
   • Place decoupling capacitors close to the power pins to ensure stable operation.

8. Handling and Storage:

   • Handle the device with care to avoid damage from electrostatic discharge (ESD).
   • Store the device in a dry and cool environment to prevent moisture damage.

9. Testing and Validation:

   • Perform thorough testing under all specified operating conditions to ensure reliable performance.
   • Validate the design with the actual hardware to confirm compliance with the datasheet specifications.

(For reference only)