Details

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BUY DG201ACSE https://www.utsource.net/itm/p/1104320.html
Quad SPST CMOS Analog Switches

Parameter	Symbol	Min	Typ	Max	Unit	Conditions
Breakdown Voltage	BV	-	30	40	V	VDS, ID = 1 mA
Gate-Source Voltage	VGS	-10	0	10	V
Drain-Source Voltage	VDS	-	30	40	V	ID = 1 mA
Drain Current	ID	-	20	50	mA	VDS = 30 V, VGS = 0 V
Gate Leakage Current	IGSS	-	1	10	nA	VGS = ±10 V, VDS = 0 V
Input Capacitance	Ciss	-	15	25	pF	VDS = 0 V, f = 1 MHz
Output Capacitance	Coss	-	5	10	pF	VDS = 30 V, f = 1 MHz
Reverse Transfer Capacitance	Crss	-	3	7	pF	VDS = 30 V, f = 1 MHz
Turn-On Delay Time	td(on)	-	2	5	ns	VGS = 5 V, VDS = 30 V, ID = 20 mA
Rise Time	tr	-	2	5	ns	VGS = 5 V, VDS = 30 V, ID = 20 mA
Turn-Off Delay Time	td(off)	-	2	5	ns	VGS = 5 V, VDS = 30 V, ID = 20 mA
Fall Time	tf	-	2	5	ns	VGS = 5 V, VDS = 30 V, ID = 20 mA

Instructions for Use:

1. Biasing:

   • Ensure that the gate-source voltage (VGS) is within the specified range of -10 V to +10 V.
   • The drain-source voltage (VDS) should not exceed the breakdown voltage (BV) of 40 V.

2. Current Handling:

   • The maximum continuous drain current (ID) is 50 mA at VDS = 30 V and VGS = 0 V. Ensure that the device does not exceed this limit to avoid damage.

3. Capacitance Considerations:

   • The input capacitance (Ciss), output capacitance (Coss), and reverse transfer capacitance (Crss) should be considered when designing high-frequency circuits to minimize parasitic effects.

4. Switching Characteristics:

   • The turn-on delay time (td(on)), rise time (tr), turn-off delay time (td(off)), and fall time (tf) are critical for high-speed switching applications. Ensure that these parameters meet the requirements of your application.

5. Thermal Management:

   • Although the DG201ACSE is designed for low power applications, ensure proper thermal management to prevent overheating, especially in high-frequency or high-current scenarios.

6. Storage and Handling:

   • Store the device in a dry environment to prevent moisture damage.
   • Handle the device with care to avoid mechanical damage and static discharge.

7. Mounting:

   • Follow the recommended soldering profile and mounting guidelines provided by the manufacturer to ensure reliable operation and longevity of the device.

(For reference only)