Details

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BUY EPF10K10LC84-3 https://www.utsource.net/itm/p/1122356.html
IC FLEX 10K FPGA 10K 84-PLCC

Parameter	Description	Value
Device Type	Logic Cell Array (LCA)	EPF10K10LC84-3
Family	FLEX 10K	-
Package	84-Pin Plastic Quad Flat Pack (PQFP)	-
Speed Grade	-3	-
Logic Cells	Number of Logic Cells	10,000
I/O Pins	Number of I/O Pins	72
Internal RAM Bits	Internal RAM (bits)	576
Multiplier Bits	Multiplier (bits)	18 x 18
Operating Voltage (Vcc)	Supply Voltage Range	3.3V ± 0.3V
Configuration Voltage	Configuration Voltage Range	3.3V ± 0.3V
Configuration Method	In-System Programmable (ISP)	JTAG, AS, PS
Configuration Memory	Configuration Memory Type	Non-Volatile Flash
Configuration Time	Typical Configuration Time	10 ms (max)
Maximum Clock Frequency	Maximum Clock Frequency (fMAX)	150 MHz (typical)
Operating Temperature	Industrial Temperature Range	-40°C to +85°C
Storage Temperature	Storage Temperature Range	-65°C to +150°C
Power Consumption	Typical Power Consumption (Active)	1.5W (typical)
Standby Current	Standby Current	10 μA (typical)
ESD Protection	Electrostatic Discharge (ESD) Protection	HBM: 2000V, MM: 200V
Package Body Size	Package Dimensions	14 mm x 14 mm
Lead Finish	Lead Finish	Tin/Lead (Sn/Pb)

Instructions for Use

1. Power Supply:

   • Ensure that the Vcc supply voltage is within the specified range of 3.3V ± 0.3V.
   • Connect the Vcc pin to a stable 3.3V power source and the GND pins to ground.

2. Configuration:

   • Use the JTAG, Active Serial (AS), or Passive Serial (PS) methods to configure the device.
   • For JTAG configuration, connect the TCK, TMS, TDI, and TDO pins to the JTAG interface.
   • For AS configuration, connect the nCONFIG, CONF_DONE, and DATA0 pins to the configuration device.
   • For PS configuration, connect the nSTATUS, nCONFIG, and DATA0 pins to the configuration device.

3. Clocking:

   • Connect the clock input to the appropriate clock pin (e.g., CLK0, CLK1).
   • Ensure that the clock signal meets the maximum frequency requirement of 150 MHz (typical).

4. I/O Connections:

   • Connect the I/O pins to the external logic as required by your design.
   • Ensure that the I/O voltages are within the operating voltage range of 3.3V ± 0.3V.

5. Thermal Management:

   • Ensure adequate cooling if the device is expected to operate at high power levels.
   • Place the device in a well-ventilated area to prevent overheating.

6. Handling:

   • Handle the device with care to avoid damage from electrostatic discharge (ESD).
   • Use proper ESD protection equipment when handling the device.

7. Storage:

   • Store the device in a dry, cool environment within the specified storage temperature range of -65°C to +150°C.

8. Testing:

   • Perform functional testing after configuration to ensure that the device is operating correctly.
   • Use boundary-scan testing via JTAG to verify the integrity of the device and its connections.

(For reference only)