Details

---

BUY 74F541SJX https://www.utsource.net/itm/p/1127643.html
8-Bit Non-Inverting Buffer/Driver

Parameter	Symbol	Min	Typical	Max	Unit	Conditions
Supply Voltage	VCC	4.75	-	5.25	V	Operating
Input Low Voltage	VIL	-	0.8	-	V	VCC = 5V
Input High Voltage	VIH	-	2.0	-	V	VCC = 5V
Output Low Voltage	VOL	-	0.4	0.5	V	IOL = 16mA
Output High Voltage	VOH	2.7	3.5	-	V	IOH = -4mA
Propagation Delay Time (Low to High)	tPLH	-	6.5	-	ns	VCC = 5V, TA = 25°C
Propagation Delay Time (High to Low)	tPHL	-	6.5	-	ns	VCC = 5V, TA = 25°C
Power Dissipation	PD	-	-	500	mW	Per Package
Operating Temperature Range	TA	-40	-	85	°C	Commercial Grade
Storage Temperature Range	TSTG	-65	-	150	°C	-

Instructions for Use:

1. Supply Voltage: Ensure that the supply voltage (V_CC) is within the range of 4.75V to 5.25V for reliable operation.
2. Input Voltage Levels: The input low voltage (V_IL) should be around 0.8V or less, and the input high voltage (V_IH) should be around 2.0V or more for V_CC = 5V.
3. Output Voltage Levels: The output low voltage (V_OL) should not exceed 0.5V when sinking 16mA, and the output high voltage (V_OH) should be at least 2.7V when sourcing -4mA.
4. Propagation Delay: The propagation delay times (t_PLH and t_PHL) are typically 6.5ns under standard conditions (V_CC = 5V, T_A = 25°C).
5. Power Dissipation: The maximum power dissipation per package is 500mW. Ensure adequate heat dissipation if operating near this limit.
6. Temperature Ranges: The device operates reliably between -40°C and 85°C (commercial grade). Store the device between -65°C and 150°C.
7. Handling: Handle the device with care to avoid static damage. Use proper ESD protection measures.
8. Mounting: Follow recommended PCB layout guidelines for optimal performance and reliability. Ensure good thermal management for high-power applications.

(For reference only)