Details

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BUY M29F040B70K6 https://www.utsource.net/itm/p/1132973.html
4 Mbit (512Kb x8, Uniform Block) Single Supply Flash Memory

Parameter	Symbol	Min	Typ	Max	Unit
Supply Voltage	Vcc	2.7	-	3.6	V
Standby Current	Icc	-	1	5	μA
Active Current	Icc	-	10	20	mA
Output High Voltage	VOH	2.4	-	Vcc-0.4	V
Output Low Voltage	VOL	0	-	0.4	V
Access Time	tAA	70	-	-	ns
Page Write Time	tPW	200	-	-	μs
Sector Erase Time	tSE	200	-	-	ms
Chip Erase Time	tCE	30	-	-	s
Data Retention	-	-	-	10	years
Operating Temperature	Toper	-40	-	85	°C
Storage Temperature	Tstg	-65	-	150	°C

Instructions for Use

1. Power Supply:

   • Ensure the supply voltage (Vcc) is within the range of 2.7V to 3.6V.
   • The device has a low standby current, typically 1μA, and an active current of up to 20mA.

2. Output Levels:

   • Output high voltage (VOH) should be at least 2.4V and can go up to Vcc - 0.4V.
   • Output low voltage (VOL) should not exceed 0.4V.

3. Timing Parameters:

   • Access time (tAA) is 70ns, which is the time required for the device to respond to a read command.
   • Page write time (tPW) is 200μs, the time needed to complete a page write operation.
   • Sector erase time (tSE) is 200ms, the time required to erase a sector.
   • Chip erase time (tCE) is 30 seconds, the time needed to erase the entire chip.

4. Data Retention:

   • The device retains data for up to 10 years under normal operating conditions.

5. Temperature Ranges:

   • Operating temperature (Toper) ranges from -40°C to 85°C.
   • Storage temperature (Tstg) ranges from -65°C to 150°C.

6. Handling and Storage:

   • Store the device in a dry, cool place to avoid moisture damage.
   • Handle with care to prevent electrostatic discharge (ESD) damage.

7. Programming and Erasing:

   • Follow the specific programming and erasing sequences provided in the datasheet to ensure reliable operation.
   • Use appropriate hardware and software tools for programming and erasing operations.

8. Pin Configuration:

   • Refer to the pin configuration diagram in the datasheet to ensure correct connections.

9. Testing:

   • Perform initial testing under controlled conditions to verify the functionality of the device.

10. Compliance:

    • Ensure that the device complies with all relevant standards and regulations for your application.

(For reference only)