74VHCT244AFT

74VHCT244AFT


Specifications
SKU
1141582
Details

BUY 74VHCT244AFT https://www.utsource.net/itm/p/1141582.html
Octal Buffer/Line Driver with 3-STATE Outputs; Package: TSSOP; No of Pins: 20; Container: Rail
Parameter Symbol Min Typ Max Unit Conditions
Supply Voltage VCC 1.65 - 5.5 V
Input Low Voltage VIL - - 0.8 V VCC = 3.3V
Input High Voltage VIH 2.0 - - V VCC = 3.3V
Output Low Voltage VOL - 0.1 0.4 V IOL = 16mA, VCC = 3.3V
Output High Voltage VOH 2.4 - - V IOH = -4mA, VCC = 3.3V
Input Leakage Current IIL - - ±1 μA VCC = 3.3V
Output Leakage Current IOL - - ±1 μA VCC = 3.3V
Propagation Delay Time tpd - 2.5 4.5 ns VCC = 3.3V, TA = 25°C
Power Dissipation PD - - 100 mW Per Package
Operating Temperature TA -40 - 125 °C
Storage Temperature TSTG -65 - 150 °C

Instructions for Use:

  1. Power Supply:

    • Ensure the supply voltage (VCC) is within the range of 1.65V to 5.5V.
    • Connect the ground (GND) pin to the system ground.
  2. Input Signals:

    • Apply input signals within the specified input voltage levels (VIL and VIH).
    • Avoid exceeding the maximum input voltage to prevent damage to the device.
  3. Output Signals:

    • Ensure the output load does not exceed the maximum current ratings (IOL and IOH).
    • Check the output voltage levels (VOL and VOH) to ensure proper logic levels.
  4. Propagation Delay:

    • Account for the propagation delay time (tpd) in your timing calculations to ensure reliable operation.
  5. Temperature Considerations:

    • Operate the device within the specified operating temperature range (TA).
    • Store the device within the storage temperature range (TSTG) to avoid damage.
  6. Handling:

    • Handle the device with care to avoid static discharge, which can damage the sensitive components.
    • Follow proper ESD (Electrostatic Discharge) precautions during handling and installation.
  7. Mounting:

    • Ensure proper soldering techniques to avoid thermal stress on the device.
    • Verify that the device is securely mounted to the PCB to prevent mechanical stress.
  8. Testing:

    • Test the device under typical operating conditions to verify its functionality.
    • Use appropriate test equipment to measure the electrical parameters and ensure they meet the specifications.
(For reference only)

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