74VHCT244AFT
Specifications
SKU
1141582
Details
BUY 74VHCT244AFT https://www.utsource.net/itm/p/1141582.html
Octal Buffer/Line Driver with 3-STATE Outputs; Package: TSSOP; No of Pins: 20; Container: Rail
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions |
|---|---|---|---|---|---|---|
| Supply Voltage | VCC | 1.65 | - | 5.5 | V | |
| Input Low Voltage | VIL | - | - | 0.8 | V | VCC = 3.3V |
| Input High Voltage | VIH | 2.0 | - | - | V | VCC = 3.3V |
| Output Low Voltage | VOL | - | 0.1 | 0.4 | V | IOL = 16mA, VCC = 3.3V |
| Output High Voltage | VOH | 2.4 | - | - | V | IOH = -4mA, VCC = 3.3V |
| Input Leakage Current | IIL | - | - | ±1 | μA | VCC = 3.3V |
| Output Leakage Current | IOL | - | - | ±1 | μA | VCC = 3.3V |
| Propagation Delay Time | tpd | - | 2.5 | 4.5 | ns | VCC = 3.3V, TA = 25°C |
| Power Dissipation | PD | - | - | 100 | mW | Per Package |
| Operating Temperature | TA | -40 | - | 125 | °C | |
| Storage Temperature | TSTG | -65 | - | 150 | °C |
Instructions for Use:
Power Supply:
- Ensure the supply voltage (VCC) is within the range of 1.65V to 5.5V.
- Connect the ground (GND) pin to the system ground.
Input Signals:
- Apply input signals within the specified input voltage levels (VIL and VIH).
- Avoid exceeding the maximum input voltage to prevent damage to the device.
Output Signals:
- Ensure the output load does not exceed the maximum current ratings (IOL and IOH).
- Check the output voltage levels (VOL and VOH) to ensure proper logic levels.
Propagation Delay:
- Account for the propagation delay time (tpd) in your timing calculations to ensure reliable operation.
Temperature Considerations:
- Operate the device within the specified operating temperature range (TA).
- Store the device within the storage temperature range (TSTG) to avoid damage.
Handling:
- Handle the device with care to avoid static discharge, which can damage the sensitive components.
- Follow proper ESD (Electrostatic Discharge) precautions during handling and installation.
Mounting:
- Ensure proper soldering techniques to avoid thermal stress on the device.
- Verify that the device is securely mounted to the PCB to prevent mechanical stress.
Testing:
- Test the device under typical operating conditions to verify its functionality.
- Use appropriate test equipment to measure the electrical parameters and ensure they meet the specifications.
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