Details

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BUY SN74CBT3345DBR https://www.utsource.net/itm/p/1142229.html
8-Bit FET Bus Switch 20-SSOP -40 to 85

Parameter	Description	Value
Part Number	Device Identifier	SN74CBT3345DBR
Function	Device Type	8-Bit Non-Inverting Bus Switch with 3-State Outputs
Supply Voltage (VCC)	Operating Voltage Range	1.65 V to 5.5 V
Operating Temperature (Toper)	Temperature Range for Operation	-40°C to 85°C
Storage Temperature (Tstg)	Temperature Range for Storage	-65°C to 150°C
Input Voltage (VIN)	Maximum Input Voltage	VCC + 0.5 V
Output Voltage (VOUT)	Maximum Output Voltage	VCC + 0.5 V
Input Current (IIN)	Maximum Input Current	±20 mA
Output Current (IOUT)	Maximum Output Current	±20 mA
Propagation Delay (tPD)	Time Delay from Input to Output	4 ns (Typical) at VCC = 5 V, TA = 25°C
Power Dissipation (PD)	Maximum Power Dissipation	350 mW
Package	Housing Type	TSSOP-24
Lead Finish	Lead Material	Matte Tin

Instructions for Use

1. Power Supply:

   • Ensure the supply voltage (VCC) is within the range of 1.65 V to 5.5 V.
   • Connect the VCC pin to the positive power supply and GND pin to the ground.

2. Signal Inputs:

   • Apply input signals to the IN pins.
   • The input voltage should not exceed VCC + 0.5 V and should not be less than -0.5 V.

3. Control Signals:

   • Use the OE (Output Enable) pin to control the state of the outputs. When OE is high, the outputs are in a high-impedance state. When OE is low, the outputs are enabled.
   • The OE pin can be driven by a logic signal or connected to VCC or GND as needed.

4. Signal Outputs:

   • The OUT pins will follow the state of the corresponding IN pins when OE is low.
   • Ensure that the output current does not exceed ±20 mA to avoid damaging the device.

5. Temperature Considerations:

   • Operate the device within the temperature range of -40°C to 85°C to ensure reliable performance.
   • Store the device in a temperature range of -65°C to 150°C.

6. Handling Precautions:

   • Handle the device with care to avoid static discharge, which can damage the sensitive components.
   • Follow standard ESD (Electrostatic Discharge) precautions during handling and assembly.

7. Mounting and Soldering:

   • Use a reflow soldering process suitable for TSSOP-24 packages.
   • Ensure proper alignment and soldering to avoid short circuits and ensure good electrical connections.

8. Testing:

   • After assembly, perform functional tests to verify the operation of the device.
   • Check the propagation delay and other timing parameters to ensure they meet the specified values.

(For reference only)