ADG408BRZ-REEL

ADG408BRZ-REEL


Specifications
SKU
1146315
Details

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4-/8-Channel High Performance Analog MultiplexersLC2MOS8
Parameter Description Value
Part Number Full Part Number ADG408BRZ-REEL
Function Type of Switch 8-Channel Analog Multiplexer/Demultiplexer
Supply Voltage (VDD to VSS) Operating Range -5.5V to +16.5V
Analog Input Voltage Range Relative to VSS VSS - 0.3V to VDD + 0.3V
Digital Supply Voltage (VDD to VSS) Operating Range -5.5V to +16.5V
Logic Input Voltage (VIL, VIH) Low and High Logic Levels VIL: 0.25V to 0.8V (VDD ≤ 4.5V)
VIH: VDD - 0.8V to VDD - 0.25V (VDD ≤ 4.5V)
On-State Resistance (RON) Maximum On-State Resistance 150 Ω (Typical at VDD = 5V)
Leakage Current (ILK) Maximum Leakage Current ±1 nA (Typical at VDD = 5V)
Bandwidth Signal Bandwidth 10 MHz (Typical at VDD = 5V)
Power Dissipation Maximum Power Dissipation 700 mW (TA = 25°C)
Operating Temperature Range Ambient Temperature -40°C to +85°C
Storage Temperature Range Storage Temperature -65°C to +150°C
Package Package Type 24-Lead SSOP (Shrink Small Outline Package)
RoHS Compliance RoHS Compliance Yes

Instructions for Use

  1. Power Supply Connection:

    • Connect VDD to the positive supply voltage and VSS to the ground.
    • Ensure the supply voltage is within the operating range (-5.5V to +16.5V).
  2. Signal Input and Output:

    • Connect the analog signals to the input channels (IN0 to IN7).
    • The selected channel will be routed to the common output (COM) based on the control inputs.
  3. Control Inputs:

    • Use the digital control lines (S0, S1, S2) to select the desired channel.
    • The enable pin (EN) must be low to enable the multiplexer; high to disable it.
  4. Logic Levels:

    • Ensure the logic levels (VIL, VIH) are within the specified ranges to avoid incorrect operation.
  5. Thermal Management:

    • Ensure adequate heat dissipation if operating near the maximum power dissipation limit.
  6. Handling and Storage:

    • Store the device in a dry environment within the specified storage temperature range.
    • Handle with care to avoid damage to the leads and package.
  7. Testing:

    • Before integrating into a circuit, test the device to ensure it meets the specified parameters.
  8. Schematic and Layout:

    • Refer to the datasheet for recommended schematic and PCB layout guidelines to ensure optimal performance.
(For reference only)

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