Details

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BUY EPF6016TC144-2N https://www.utsource.net/itm/p/1152123.html
IC FLEX 6000 FPGA 16K 144-TQFP

Below is the parameter table and instructions for the EPF6016TC144-2N, which is a Cyclone FPGA from Altera (now part of Intel).

Parameter Table

Parameter	Symbol	Min	Typical	Max	Unit
Supply Voltage	VCC	2.9	3.3	3.7	V
I/O Supply Voltage	VCCIO	2.9	3.3	3.7	V
Core Supply Voltage	VCCINT	1.7	1.8	1.9	V
Configuration Voltage	VCCCONF	2.9	3.3	3.7	V
Operating Temperature	Toper	-40		85	°C
Storage Temperature	Tstg	-65		150	°C
Maximum Power Consumption	Pmax		1.5		W
Maximum I/O Current	I/O		24		mA
Configuration Time	tconf		10		ms
Number of I/O Pins			144
Number of Logic Elements			6,016
Number of Embedded Memory Bits			288,000
Number of Multipliers			56

Instructions

1. Power Supply Connections:

   • Connect VCC (3.3V) to all VCC pins.
   • Connect VCCIO (3.3V) to all VCCIO pins.
   • Connect VCCINT (1.8V) to all VCCINT pins.
   • Connect VCCCONF (3.3V) to the configuration voltage pin.
   • Ground all GND pins.

2. Configuration:

   • Use a JTAG or AS (Active Serial) configuration method.
   • Ensure the configuration voltage (VCCCONF) is stable before starting the configuration process.
   • Configuration time is typically around 10 milliseconds.

3. Operating Conditions:

   • Ensure the operating temperature is within the range of -40°C to 85°C.
   • Store the device in an environment where the temperature does not exceed -65°C to 150°C.

4. Signal Integrity:

   • Use proper termination techniques for high-speed signals to avoid reflections and signal degradation.
   • Ensure that all unused I/O pins are either tied to VCC or GND, depending on the design requirements.

5. Power Management:

   • Monitor the power consumption to ensure it does not exceed 1.5W to prevent overheating and potential damage.
   • Use decoupling capacitors close to the power supply pins to filter out noise and provide stable power.

6. Handling and Storage:

   • Handle the device with care to avoid static discharge, which can damage the internal circuits.
   • Store the device in a dry, cool place to prevent moisture damage.

7. Testing:

   • After configuration, perform functional tests to verify that the device is operating correctly.
   • Use boundary-scan testing (JTAG) to check for manufacturing defects and ensure proper connectivity.

By following these instructions, you can ensure the reliable operation of the EPF6016TC144-2N FPGA in your application.

(For reference only)