24LC16B/SN

24LC16B/SN

Category: IC ChipsMemory

Specifications
SKU
1185360
Details

BUY 24LC16B/SN https://www.utsource.net/itm/p/1185360.html
Triple, 128-Position, Nonvolatile, Variable, Digital Resistor/Switch
Parameter Symbol Conditions Min Typical Max Unit
Operating Voltage VCC - 1.8 - 5.5 V
Standby Current ICC(SB) VCC = 5.5V, 100 kHz, VIL = 0.4V - 1 - μA
Standby Current ICC(SB) VCC = 1.8V, 100 kHz, VIL = 0.4V - 0.5 - μA
Active Current ICC(ACT) VCC = 5.5V, 100 kHz, VIH = 2.0V - 3 - mA
Active Current ICC(ACT) VCC = 1.8V, 100 kHz, VIH = 2.0V - 1 - mA
Write Cycle Time tWC VCC = 5.5V - 5 - ms
Write Cycle Time tWC VCC = 1.8V - 10 - ms
Page Write Time tPW - - 5 - ms
Data Retention - - - 100 - years
Operating Temperature Toper - -40 - 85 °C
Storage Temperature Tstg - -65 - 150 °C

Instructions for 24LC16B/SN

  1. Power Supply:

    • Ensure the operating voltage (VCC) is within the range of 1.8V to 5.5V.
    • The device can operate at a standby current of up to 1μA at 5.5V and 0.5μA at 1.8V.
  2. Communication:

    • The 24LC16B/SN uses the I2C protocol for communication.
    • The I2C bus supports a maximum clock frequency of 100 kHz.
    • Ensure the SDA and SCL lines are pulled up with appropriate resistors (typically 4.7kΩ).
  3. Write Operations:

    • The write cycle time varies depending on the supply voltage:
      • 5ms at 5.5V
      • 10ms at 1.8V
    • A page write operation can take up to 5ms.
  4. Read Operations:

    • Data can be read from the device using standard I2C read commands.
    • Ensure the device address is correctly set (default is 0x50).
  5. Data Retention:

    • The device guarantees data retention for up to 100 years under normal operating conditions.
  6. Temperature Range:

    • The operating temperature range is from -40°C to 85°C.
    • The storage temperature range is from -65°C to 150°C.
  7. Handling:

    • Handle the device with care to avoid electrostatic discharge (ESD).
    • Use proper grounding and ESD protection when handling or soldering the device.
  8. Programming:

    • Refer to the datasheet for detailed programming sequences and timing diagrams.
    • Ensure that all write operations are completed before initiating new operations to avoid data corruption.
(For reference only)

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