Details

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LC2MOS 5O RON SPST Switches; Package: TSSOP; No of Pins: 16; Temperature Range: Industrial

Parameter	Symbol	Min	Typical	Max	Unit
Supply Voltage	VDD	4.5	-	16	V
Off-State Resistance	Roff	-	100	-	kΩ
On-State Resistance	Ron	-	12	-	Ω
Leakage Current	IL	-	1	-	nA
Input Signal Range	Vsig	-VDD-0.3	-	VDD+0.3	V
Switching Time (Typical)	tsw	-	1	-	μs
Power Dissipation	PD	-	100	-	mW
Operating Temperature	Toper	-40	-	85	°C
Storage Temperature	Tstg	-65	-	150	°C

Instructions for Use:

1. Power Supply:

   • Ensure the supply voltage (VDD) is within the specified range of 4.5V to 16V.
   • Connect the power supply to the VDD and GND pins.

2. Signal Input:

   • The input signal (Vsig) should be within the range of -VDD-0.3V to VDD+0.3V to avoid damage to the device.
   • Connect the input signal to the appropriate input pin.

3. Control Signals:

   • Use the control signals to switch the analog switches on or off. Refer to the datasheet for specific control logic levels.

4. Leakage Current:

   • The leakage current (IL) is typically 1 nA. Ensure that this is accounted for in your circuit design, especially in low-current applications.

5. Switching Time:

   • The typical switching time (tsw) is 1 μs. Design your system to accommodate this delay when switching states.

6. Thermal Management:

   • The operating temperature range is -40°C to 85°C. Ensure adequate cooling if operating near the upper limit.
   • Store the device within the storage temperature range of -65°C to 150°C.

7. Power Dissipation:

   • The typical power dissipation (PD) is 100 mW. Ensure that the device is not subjected to excessive power dissipation to avoid overheating.

8. Handling:

   • Handle the device with care to avoid static discharge, which can damage the sensitive components.
   • Follow ESD (Electrostatic Discharge) precautions during handling and installation.

9. Mounting:

   • Mount the device on a PCB using standard surface mount technology (SMT) techniques.
   • Ensure proper soldering and alignment to prevent mechanical stress on the device.

10. Testing:

    • After mounting, test the device to ensure it meets the specified performance parameters.
    • Verify the functionality of the switches by applying known input signals and measuring the output.

(For reference only)