AT49BV162AT-70TU

AT49BV162AT-70TU

Category: IC ChipsMemory

Specifications
SKU
1209089
Details

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IC FLASH 16MBIT PARALLEL 48TSOP
Parameter Description Value
Device Type Non-Volatile Flash Memory -
Density Memory Density 16 Mbit (2 M x 8)
Package Package Type TSSOP-48
Operating Voltage (Vcc) Supply Voltage Range 2.7V to 3.6V
Access Time (tACC) Access Time 70 ns
Data Retention Data Retention Time 10 years
Programming Cycle Time Programming Cycle Time 2 ms (Typical)
Erase Cycle Time Block Erase Time 1 s (Typical)
Endurance Program/Erase Cycles 100,000 cycles
Operating Temperature (Toper) Operating Temperature Range -40°C to +85°C
Storage Temperature (Tstg) Storage Temperature Range -65°C to +150°C
Standby Current (ISB) Standby Current 1 μA (Max)
Active Current (IAB) Active Current 20 mA (Max)
Write Protect Write Protect Pin WP#
Hold Function Hold Function Pin HOLD#
Command Set Command Set Compatibility JEDEC JESD68 Standard
Pin Configuration Pin Count 48 pins

Instructions for Use:

  1. Power Supply:

    • Connect Vcc to the supply voltage (2.7V to 3.6V).
    • Connect Vss to ground.
  2. Address Lines:

    • Connect A0-A19 to the address lines to select the memory location.
  3. Data Lines:

    • Connect D0-D7 to the data lines for reading and writing data.
  4. Control Signals:

    • OE# (Output Enable): Low to enable read operations.
    • WE# (Write Enable): Low to initiate write operations.
    • CE# (Chip Enable): Low to select the device.
    • WP# (Write Protect): High to allow writes; low to prevent writes.
    • HOLD# (Hold): High to allow normal operation; low to pause the device.
  5. Programming and Erasing:

    • Block Erase: Apply the appropriate command sequence to erase a block of memory.
    • Page Program: Write data to a page by applying the program command and data.
  6. Timing Considerations:

    • Ensure that all timing parameters (e.g., access time, programming cycle time, erase cycle time) are met to avoid data corruption.
  7. Handling Precautions:

    • Handle the device with care to avoid static discharge.
    • Store the device in a dry environment to prevent moisture damage.
  8. Testing and Validation:

    • Perform thorough testing to ensure the device is functioning correctly before deployment.

For detailed command sequences and advanced features, refer to the datasheet provided by the manufacturer.

(For reference only)

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