Details

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BUY SN74LVC1G19DCKR https://www.utsource.net/itm/p/1222538.html
1-OF-2 DECODER/DEMULTIPLEXER

Parameter	Symbol	Min	Typical	Max	Unit	Conditions
Supply Voltage	VCC	1.65	-	5.5	V	-
Input Low Voltage	VIL	-0.5	-	0.8	V	VCC = 1.65V to 5.5V
Input High Voltage	VIH	2.0	-	VCC + 0.5	V	VCC = 1.65V to 5.5V
Output Low Voltage	VOL	-0.5	0.1	0.3	V	IOL = 4 mA, VCC = 1.65V to 5.5V
Output High Voltage	VOH	2.4	4.5	VCC + 0.5	V	IOH = -4 mA, VCC = 1.65V to 5.5V
Propagation Delay Time (Low to High)	tPLH	-	5.0	10.0	ns	VCC = 3.3V, IOL = 4 mA, IOH = -4 mA
Propagation Delay Time (High to Low)	tPHL	-	5.0	10.0	ns	VCC = 3.3V, IOL = 4 mA, IOH = -4 mA
Power Dissipation	PD	-	-	350	mW	Continuous
Operating Temperature Range	TA	-40	-	125	°C	-
Storage Temperature Range	TSTG	-65	-	150	°C	-

Instructions for Use:

1. Power Supply:

   • Ensure the supply voltage (V_CC) is within the range of 1.65V to 5.5V.
   • Connect the ground (GND) pin to a stable ground reference.

2. Input Signals:

   • Apply input signals within the specified input voltage levels (V_IL and V_IH).
   • Avoid applying voltages outside the range of -0.5V to V_CC + 0.5V to prevent damage.

3. Output Signals:

   • Ensure the load connected to the output does not exceed the maximum current ratings (I_OL and I_OH).
   • Check the output voltage levels (V_OL and V_OH) to ensure proper operation.

4. Timing:

   • Consider the propagation delay times (t_PLH and t_PHL) when designing your circuit to avoid timing issues.

5. Temperature:

   • Operate the device within the specified operating temperature range (-40°C to 125°C).
   • Store the device within the storage temperature range (-65°C to 150°C).

6. Handling:

   • Handle the device with care to avoid static discharge, which can damage the internal components.
   • Follow standard ESD (Electrostatic Discharge) precautions during handling and installation.

7. Mounting:

   • Ensure proper mounting on the PCB to maintain good thermal performance and mechanical stability.
   • Use appropriate soldering techniques and temperatures to avoid thermal stress on the device.

(For reference only)