Details

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BUY SN74LVC1G06DCKR https://www.utsource.net/itm/p/1223132.html
SINGLE INVERTER BUFFER/DRIVER WITH OPEN-DRAIN OUTPUT

Parameter	Symbol	Conditions	Min	Typical	Max	Unit
Supply Voltage	VCC	-	1.65	-	5.5	V
Input Low Voltage	VIL	VCC = 2.0V to 5.5V	-	-	0.8	V
Input High Voltage	VIH	VCC = 2.0V to 5.5V	2.0	-	VCC	V
Output Low Voltage	VOL	IOL = 4 mA, VCC = 1.65V to 5.5V	0	-	0.1	V
Output High Voltage	VOH	IOH = -4 mA, VCC = 1.65V to 5.5V	VCC - 0.1	-	VCC	V
Propagation Delay Time (Positive Edge)	tpd(+)	VCC = 5.5V, TA = 25°C, VI = 0.8V to 3.5V	-	3.9	-	ns
Propagation Delay Time (Negative Edge)	tpd(-)	VCC = 5.5V, TA = 25°C, VI = 3.5V to 0.8V	-	3.9	-	ns
Power Dissipation	PD	Continuous	-	-	100	mW
Operating Temperature Range	TA	-	-40	-	85	°C
Storage Temperature Range	TSTG	-	-65	-	150	°C

Instructions for Use:

1. Supply Voltage (V_CC):

   • Ensure the supply voltage is within the range of 1.65V to 5.5V.
   • Connect the V_CC pin to the power supply and the GND pin to ground.

2. Input Voltage (V_IL, V_IH):

   • The input low voltage (V_IL) should be less than or equal to 0.8V.
   • The input high voltage (V_IH) should be greater than or equal to 2.0V and less than or equal to V_CC.

3. Output Voltage (V_OL, V_OH):

   • The output low voltage (V_OL) should be less than or equal to 0.1V when sinking 4 mA.
   • The output high voltage (V_OH) should be greater than or equal to V_CC - 0.1V when sourcing -4 mA.

4. Propagation Delay (t_pd):

   • The propagation delay time for both positive and negative edges is typically 3.9 ns at V_CC = 5.5V and T_A = 25°C.

5. Power Dissipation (P_D):

   • The maximum continuous power dissipation is 100 mW.

6. Operating and Storage Temperature:

   • The operating temperature range is from -40°C to 85°C.
   • The storage temperature range is from -65°C to 150°C.

7. Handling and Storage:

   • Handle the device with care to avoid static damage.
   • Store the device in a dry, cool place within the specified storage temperature range.

8. Mounting:

   • Ensure proper soldering and mounting techniques to prevent thermal and mechanical stress on the device.

9. Testing:

   • Test the device under the specified conditions to ensure it meets the required performance parameters.

(For reference only)