MM74HCT574N

MM74HCT574N

Category: IC Chips

Specifications
SKU
1273353
Details

BUY MM74HCT574N https://www.utsource.net/itm/p/1273353.html
ESD Protection Dual Common Anode Diodes 6.8 V SC-70; Package: SC-70 SOT-323 3 LEAD; No of Pins: 3; Container: Tape and Reel; Qty per Container: 3000
Parameter Symbol Conditions Min Typ Max Unit
Supply Voltage VCC Operating 2.0 - 6.0 V
Input Low Voltage VIL VCC = 4.5V to 5.5V 0.8 - - V
Input High Voltage VIH VCC = 4.5V to 5.5V - - 2.0 V
Output Low Voltage VOL IOL = 4.0mA, VCC = 4.5V to 5.5V 0.1 - 0.4 V
Output High Voltage VOH IOH = -0.4mA, VCC = 4.5V to 5.5V 2.4 - 3.4 V
Input Leakage Current IIL VCC = 4.5V to 5.5V -1.0 - 1.0 μA
Output Leakage Current IOL VCC = 4.5V to 5.5V -1.0 - 1.0 μA
Propagation Delay Time tpd VCC = 4.5V to 5.5V, TA = 25°C - 15 25 ns
Power Dissipation PD Continuous - - 100 mW

Instructions for Use:

  1. Power Supply:

    • Ensure the supply voltage (VCC) is within the operating range of 2.0V to 6.0V.
    • Connect the ground (GND) pin to a stable reference ground.
  2. Input Signals:

    • For a logic low input, the voltage should be less than 0.8V when VCC is between 4.5V and 5.5V.
    • For a logic high input, the voltage should be greater than 2.0V when VCC is between 4.5V and 5.5V.
  3. Output Signals:

    • The output low voltage (VOL) should not exceed 0.4V when sourcing 4.0mA.
    • The output high voltage (VOH) should be at least 2.4V when sinking -0.4mA.
  4. Leakage Current:

    • Monitor input and output leakage currents to ensure they do not exceed ±1.0μA.
  5. Propagation Delay:

    • The propagation delay time (tpd) should be within 15ns to 25ns under typical conditions.
  6. Power Dissipation:

    • Do not exceed the maximum power dissipation of 100mW to avoid overheating and potential damage to the device.
  7. Handling:

    • Handle the MM74HCT574N with care to avoid static discharge, which can damage the device.
    • Follow standard ESD (Electrostatic Discharge) precautions when working with the component.
  8. Storage:

    • Store the device in a dry, cool place away from direct sunlight and moisture to maintain its integrity.
(For reference only)

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