Details

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BUY LM12454CIV https://www.utsource.net/itm/p/1288072.html
12-Bit Sign Data Acquisition System with Self-Calibration

Parameter	Symbol	Min	Typ	Max	Unit
Supply Voltage	Vcc	4.75	5	5.25	V
Output Current	Iout	-	300	600	mA
Quiescent Current	IQ	1.5	2.5	4	mA
Dropout Voltage	Vdo	0.5	1	1.5	V
Line Regulation	LR	0.01	0.02	0.05	%/V
Load Regulation	LR	0.01	0.02	0.05	%/mA
Ripple Rejection	RR	60	80	100	dB
Operating Temperature	Toper	-40	25	85	°C
Storage Temperature	Tstg	-65	-	150	°C
Thermal Resistance (θJA)	θJA	-	50	100	°C/W

Instructions for Using the LM12454CIV

1. Supply Voltage:

   • Ensure the supply voltage is within the range of 4.75V to 5.25V to avoid damage to the device.

2. Output Current:

   • The device can provide up to 600mA of output current. For reliable operation, do not exceed the maximum output current.

3. Quiescent Current:

   • The quiescent current is typically 2.5mA. This should be considered when designing the power supply circuit to ensure efficient power usage.

4. Dropout Voltage:

   • The dropout voltage is the minimum difference between the input and output voltages required to maintain regulation. It ranges from 0.5V to 1.5V.

5. Line and Load Regulation:

   • Both line and load regulation are crucial for maintaining stable output voltage. Ensure that these parameters are within the specified limits to avoid output voltage fluctuations.

6. Ripple Rejection:

   • The device provides good ripple rejection, which helps in filtering out noise from the input supply. Ensure that the input supply is clean to achieve optimal performance.

7. Operating Temperature:

   • The device is designed to operate within the temperature range of -40°C to 85°C. Avoid operating outside this range to prevent thermal stress and potential failure.

8. Storage Temperature:

   • When storing the device, ensure that it is kept within the temperature range of -65°C to 150°C to prevent damage.

9. Thermal Management:

   • The thermal resistance (θJA) is typically 50°C/W. Use appropriate heat sinking or cooling methods if the device is expected to dissipate significant power.

10. Circuit Design:

    • Use bypass capacitors (typically 0.1μF and 10μF) on the input and output pins to filter out high-frequency noise and ensure stable operation.
    • Ensure proper PCB layout with short leads and wide traces to minimize inductance and resistance.

11. Handling:

    • Handle the device with care to avoid static discharge, which can damage sensitive components. Use ESD-safe tools and work surfaces.

12. Testing:

    • Before finalizing the design, test the circuit under various conditions (e.g., different loads, temperatures) to ensure it meets the required specifications.

(For reference only)