Details

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BUY DS1225AD-70IND https://www.utsource.net/itm/p/1317243.html
64k Nonvolatile SRAM

Parameter	Description	Value
Part Number	Device identifier	DS1225AD-70IND
Type	Type of device	Dual 8-Bit I2C Bus Expander with Interrupt Output
Operating Voltage	Supply voltage range	2.5V to 5.5V
I2C Bus Speed	Maximum I2C bus speed	400 kHz
Input/Output Ports	Number of I/O ports	16 (2 x 8-bit)
Interrupt Output	Output for interrupt generation	Yes
Operating Temperature	Temperature range for operation	-40°C to +85°C
Storage Temperature	Temperature range for storage	-65°C to +150°C
Package	Package type	SOIC-16
Power Consumption	Typical power consumption at 3.3V and 25°C	1.0 μA
Supply Current	Maximum supply current	10 μA
Output Drive Current	Maximum output drive current per pin	±10 mA

Instructions for Use

1. Power Supply:

   • Connect the VCC pin to a supply voltage between 2.5V and 5.5V.
   • Connect the GND pin to the ground.

2. I2C Bus Connection:

   • Connect the SDA and SCL pins to the I2C bus lines.
   • Ensure that pull-up resistors are used on the SDA and SCL lines, typically 4.7kΩ to VCC.

3. Address Configuration:

   • The device has a fixed I2C address of 0x20. No external address configuration is required.

4. Initialization:

   • Send a start condition followed by the device address and write bit to initialize communication.
   • Write to the configuration registers to set the direction of the I/O ports (input or output).

5. Reading and Writing Data:

   • To read data from the I/O ports, send a start condition, device address, and read bit.
   • To write data to the I/O ports, send a start condition, device address, and write bit followed by the data to be written.

6. Interrupt Handling:

   • The INT pin can be used to generate interrupts when a change in the input state occurs.
   • Configure the interrupt control register to enable specific interrupt conditions.

7. Power Management:

   • The device has low power consumption, but ensure that it is powered down when not in use to save energy.

8. Handling and Storage:

   • Store the device in a dry, temperature-controlled environment to avoid damage.
   • Handle the device with care to prevent static discharge and physical damage.

For detailed programming examples and advanced features, refer to the datasheet provided by the manufacturer.

(For reference only)