Details

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BUY EP20K300EFC672-3 https://www.utsource.net/itm/p/1325058.html
APEX 20K Devices: System-on-a-Programmable-Chip Solutions; 672 pin FBGA; 0 to 85°C

Parameter	Description	Value
Device	Cyclone II Family	EP20K300EFC672-3
Package	Fine Line Ball Grid Array (FBGA)	672 Balls
Speed Grade	Commercial Temperature Range (-40°C to +85°C)	-3
Configuration Memory	Configuration Flash Memory	1 Mbit
Logic Cells	Number of Logic Cells	300,000
RAM Bits	Embedded Memory Bits	1,440,000
DSP Blocks	Number of DSP Blocks	48
I/O Pins	Number of I/O Pins	496
Clock Resources	Dedicated Clock Inputs	8
PLLs	Phase-Locked Loops (PLLs)	4
Operating Voltage	Core Voltage (Vcc)	1.5V
I/O Voltage	I/O Voltage (VccIO)	1.5V, 1.8V, 2.5V, 3.3V
Power Consumption	Typical Power Consumption	Varies based on design
Configuration Modes	Configuration Modes	Active Serial, Passive Serial, JTAG
Configuration Time	Typical Configuration Time	< 10 ms (for 1 Mbit)
Temperature Range	Operating Temperature Range	-40°C to +85°C
Storage Temperature	Storage Temperature Range	-65°C to +150°C
Humidity	Non-condensing humidity	5% to 95%
ESD Rating	Human Body Model (HBM) ESD Rating	2000V
MTBF	Mean Time Between Failures (MTBF)	> 1,000,000 hours
RoHS Compliance	Restriction of Hazardous Substances (RoHS) Compliance	Yes

Instructions for Use

1. Power Supply Requirements:

   • Ensure that the core voltage (Vcc) is set to 1.5V.
   • The I/O voltage (VccIO) can be set to 1.5V, 1.8V, 2.5V, or 3.3V depending on your application requirements.

2. Configuration:

   • Use the appropriate configuration mode (Active Serial, Passive Serial, or JTAG) to program the device.
   • Ensure that the configuration flash memory is properly connected and configured.

3. Clocking:

   • Connect external clock sources to the dedicated clock inputs.
   • Utilize the PLLs for clock generation and distribution within the device.

4. I/O Handling:

   • Configure the I/O pins according to your design needs.
   • Ensure that the I/O voltage levels are compatible with the connected peripherals.

5. Thermal Management:

   • Ensure adequate cooling to keep the device within the operating temperature range (-40°C to +85°C).
   • Consider using heat sinks or other cooling solutions if necessary.

6. ESD Protection:

   • Handle the device with care to avoid ESD damage.
   • Use ESD-safe equipment and practices when handling the device.

7. Storage:

   • Store the device in a dry, non-condensing environment with a temperature range of -65°C to +150°C.

8. Testing:

   • Perform thorough testing of the device in your application to ensure it meets all performance and reliability requirements.

9. Documentation:

   • Refer to the detailed datasheet and user manual for more specific information and advanced features.

(For reference only)