Details

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BUY XC3020A-7PC84C https://www.utsource.net/itm/p/1327000.html
Field Programmable Gate Arrays XC3000A/L, XC3100A/L

Parameter	Description	Value
Device Type	Low Noise, Low Dropout Linear Regulator
Input Voltage (VIN)	Minimum Input Voltage	1.7 V
	Maximum Input Voltage	5.5 V
Output Voltage (VOUT)	Fixed Output Voltage	3.3 V
Output Current (IOUT)	Continuous Output Current	200 mA
Quiescent Current (IQ)	Quiescent Current at No Load	20 μA
Dropout Voltage (VDROP)	Dropout Voltage at 200 mA	200 mV
PSRR (Power Supply Rejection Ratio)	PSRR at 1 kHz	60 dB
Line Regulation	Line Regulation	0.01%
Load Regulation	Load Regulation	0.1%
Operating Temperature (TJ)	Junction Temperature Range	-40°C to 125°C
Package Type	SOT-23-5
Storage Temperature (TS)	Storage Temperature Range	-65°C to 150°C
Thermal Resistance (θJA)	Thermal Resistance from Junction to Ambient	125°C/W

Instructions for Use

1. Power Supply Connection:

   • Connect the input voltage (VIN) to the VIN pin.
   • Connect the output voltage (VOUT) to the VOUT pin.
   • Ensure that the input voltage is within the specified range (1.7 V to 5.5 V).

2. Grounding:

   • Connect the ground (GND) pin to the system ground.

3. Capacitors:

   • Place a 1 μF ceramic capacitor close to the VIN pin to filter input noise.
   • Place a 1 μF ceramic capacitor close to the VOUT pin to stabilize the output.

4. Output Current:

   • The device can provide up to 200 mA of continuous output current. Ensure that the load does not exceed this limit to avoid overheating or damage.

5. Thermal Management:

   • The device has a thermal resistance of 125°C/W. Ensure adequate heat dissipation if operating at high output currents or in high ambient temperatures.

6. Operating Temperature:

   • The device is rated to operate over a junction temperature range of -40°C to 125°C. Ensure that the operating conditions do not exceed these limits.

7. Storage:

   • Store the device in a dry environment with a temperature range of -65°C to 150°C.

8. Handling:

   • Handle the device with care to avoid static discharge and physical damage. Use proper ESD protection when handling the device.

9. Mounting:

   • Mount the device on a PCB using standard surface mount technology (SMT) processes. Ensure that the solder joints are clean and free of voids.

10. Testing:

    • After mounting, test the device to ensure proper functionality. Measure the output voltage under load to verify stability and accuracy.

(For reference only)