AT24C21-10SI-2.5

AT24C21-10SI-2.5

Category: IC ChipsMemory

Specifications
SKU
1329658
Details

BUY AT24C21-10SI-2.5 https://www.utsource.net/itm/p/1329658.html
2-Wire Serial EEPROM
Parameter Symbol Min Typ Max Unit Notes
Operating Voltage VCC 1.7 - 5.5 V
Standby Current ISTANDBY - 1 5 μA VCC = 1.8V to 5.5V
Operating Current (Read) IR - 1 3 mA VCC = 1.8V to 5.5V
Operating Current (Write) IW - 3 5 mA VCC = 1.8V to 5.5V
Data Retention Time tRET - - 100 Years @ 85°C
Write Cycle Time tWC - 5 10 ms
Page Write Time tPW - 5 10 ms
Storage Temperature TSTORAGE -40 - 85 °C
Operating Temperature TOP -40 - 85 °C
Memory Size - - 256 - Kbits 32K x 8
Organization - - 32 - Pages 8 bytes per page
Package Type - - SOIC - - 8-pin

Instructions for Using AT24C21-10SI-2.5

  1. Power Supply:

    • Ensure the operating voltage is within the range of 1.7V to 5.5V.
    • The standby current is typically 1μA, and the operating current for read and write operations is 1mA and 3mA, respectively.
  2. Data Retention:

    • The device retains data for up to 100 years at a temperature of 85°C.
  3. Write Operations:

    • The write cycle time is 5 to 10 milliseconds.
    • Page write time is also 5 to 10 milliseconds.
    • Each page can hold 8 bytes of data.
  4. Temperature Considerations:

    • The storage temperature range is from -40°C to 85°C.
    • The operating temperature range is also from -40°C to 85°C.
  5. Memory Organization:

    • The memory size is 256 Kbits, organized as 32 pages with 8 bytes per page.
  6. Package:

    • The device comes in an 8-pin SOIC package.
  7. Communication Protocol:

    • Use the I2C protocol for communication with the device.
    • Ensure the I2C bus lines (SCL and SDA) are properly pulled up to VCC using appropriate resistors.
  8. Addressing:

    • The device has a fixed I2C address. Refer to the datasheet for the specific address.
  9. Handling:

    • Handle the device with care to avoid static damage.
    • Follow proper soldering techniques to ensure reliable connections.
  10. Testing:

    • After assembly, test the device by reading and writing to it to verify functionality.

For detailed information and specific application notes, refer to the official datasheet provided by the manufacturer.

(For reference only)

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